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DSC8103AI2-T

Microchip Technology

DSC8103AI2-T by Microchip Technology

Microchip Technology's DSC8103AI2-T is a LVDS XO Clock Oscillator with 25% frequency stability, operating from 10 MHz to 460 MHz. It has a max supply voltage of 3.6 V and output load of 50 Ohm, 2 pF, suitable for applications requiring precise timing in temperature-sensitive environments.

Median Price

$4.750

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 19 parts In-Stock

1+ parts

$4.750

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19

$4.750

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Vyrian

USA . 617 parts In-Stock

1+ parts

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617

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 188 parts In-Stock

1+ parts

$2.039

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188

$2.039

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Ampacity Inc.

Singapore . 1,180 parts In-Stock

1+ parts

$4.010

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1,180

$4.010

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Continental Prestige Electronics

USA . 3,332 parts In-Stock

1+ parts

$4.750

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$4.655

3,332

$4.750

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$4.655

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.750

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$4.655

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1,000

$4.750

$4.655

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AZTECH Wire

Italy . 788 parts In-Stock

1+ parts

$12.017

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788

$12.017

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West Coast Incorporated

USA . 4,089 parts In-Stock

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4,089

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Argo Parts USA

USA . 1,720 parts In-Stock

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1,720

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Overview

Elevate your projects with the DSC8103AI2-T by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality XO Clock Oscillators that guarantee superior performance and reliability. Designed for a wide range of applications, this oscillator offers exceptional frequency stability and precise output, making it a valuable asset for your electronic designs. Trust in Microchip Technology to provide you with the cutting-edge technology you need to succeed.

Feature Benefit Bullets

Frequency Stability: 25%

Provides precise and stable frequency output, ensuring accurate timekeeping in various applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply compatibility, making it versatile for different electronic devices.

Output Load: 50 OHM, 2 pF

Suitable for driving standard loads with minimal impact on frequency accuracy.

Oscillator Type: LVDS

Low Voltage Differential Signaling technology ensures high speed and low power consumption, ideal for modern electronic systems.

Maximum Rise Time: 0.2 ms

Provides fast signal rise time for quick response in timing applications.

Physical Dimension: 7.0mm x 5.0mm x 0.85mm

Compact size allows for easy integration into densely populated PCBs.

Minimum Supply Voltage: 2.25 V

Can operate at lower voltages, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can function in extreme cold environments, making it suitable for outdoor and harsh conditions.

Maximum Fall Time: 0.2 ns

Ensures rapid signal fall time for precise timing and synchronization in digital systems.

Maximum Symmetry (%): 52/48

Provides balanced duty cycle for consistent signal processing in communication and data transfer.

Minimum Operating Frequency: 10 MHz

Supports a wide range of frequency requirements for diverse applications.

Mounting Feature: SURFACE MOUNT

Easy to mount on PCBs, saving space and simplifying manufacturing processes.

Maximum Operating Frequency: 460 MHz

Capable of high-frequency operation, suitable for demanding high-speed communication systems.

Technical Specifications

XO Clock Oscillators DSC8103AI2-T attributes and parameters. Explore more XO Clock Oscillators devices from Microchip Technology

Specs

Additional Features:

STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR

Maximum Fall Time:

.2 ns

Frequency Adjustment (Mechanical):

NO

Frequency Stability:

Mounting Feature:

Maximum Operating Frequency:

460 MHz

Minimum Operating Frequency:

10 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

50 OHM, 2 pF

Physical Dimension:

7.0mm x 5.0mm x 0.85mm

Maximum Rise Time:

.2 ms

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.25 V

Maximum Symmetry (%):

52/48

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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