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DSC613RI2A-016PT

Microchip Technology

DSC613RI2A-016PT by Microchip Technology

DSC613RI2A-016PT by Microchip Technology is a clock generator with a max output frequency of 25 MHz. It operates b/w -40 to 85°C and has a supply voltage range of 1.71V to 3.63V. This rectangular package with grid array style is ideal for various peripheral IC applications requiring precise clock generation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,571 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$17.059

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225

$17.059

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Ampacity Inc.

Singapore . 585 parts In-Stock

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$27.000

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585

$27.000

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Montano Global Distributors

Canada . 6,845 parts In-Stock

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NIA Electronics

USA . 6,763 parts In-Stock

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Ledger Components

France . 6,763 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,153 parts In-Stock

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LMD Electronica

Estonia . 4,431 parts In-Stock

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Microchip USA

USA . 1,226 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Elevate your projects with the DSC613RI2A-016PT by Microchip Technology, a top-quality clock generator designed to meet your needs. With a maximum output clock frequency of 25 MHz and a compact rectangular package shape, this surface mount device is perfect for a wide range of applications. Trust in the reliability and expertise of Microchip Technology to deliver cutting-edge solutions for your projects. Experience the seamless integration, precise timing, and exceptional performance that this product offers. Say goodbye to complications and hello to efficiency with the DSC613RI2A-016PT.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and potentially reducing manufacturing costs.

Maximum Supply Voltage: 3.63 V

Provides flexibility in powering the device within a safe operating range.

Package Shape: RECTANGULAR

Standard shape that is easy to handle and integrate into circuit designs.

Maximum Output Clock Frequency: 25 MHz

Offers high-frequency clock signals for demanding applications.

No. of Terminals: 6

Provides necessary connections for proper functionality while keeping the design compact.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables precise and secure mounting on PCBs with a thin profile for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Allows for operation at lower voltages, potentially saving power and extending battery life.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments without issues.

Terminal Position: BOTTOM

Facilitates convenient connection and soldering on the underside of the PCB.

Maximum Seated Height: 0.89 mm

Low profile design helps in fitting the component in tight spaces.

Width: 2 mm

Compact size allows for efficient use of board space.

Length: 2.5 mm

Small footprint contributes to overall space-saving in the circuit layout.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Specifically designed for clock generation applications, ensuring accurate timing signals for the system.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable operation.

Terminal Form: NO LEAD

Lead-free construction complies with environmental regulations and avoids potential lead contamination issues.

Terminal Pitch: 0.825 mm

Fine pitch spacing for terminals allows for high-density mounting on the PCB and facilitates miniaturization of the overall design.

Technical Specifications

Clock Generators DSC613RI2A-016PT attributes and parameters. Explore more Clock Generators devices from Microchip Technology

Specs

JESD-30 Code:

R-XBGA-N6

Length:

2.5 mm

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

25 MHz

Package Code:

Package Equivalence Code:

LGA6,2X3,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.71 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.825 mm

Terminal Position:

BOTTOM

Width:

2 mm

Peripheral IC Type:

Trade Compliance

DSC613RI2A-016PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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