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DS3104GN-W

Microchip Technology

DS3104GN-W by Microchip Technology

ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LBGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,928 parts In-Stock

1+ parts

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1,928

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Digiode

USA . 1,404 parts In-Stock

1+ parts

-

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1,404

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Vyrian

USA . 1,024 parts In-Stock

1+ parts

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1,024

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 811 parts In-Stock

1+ parts

$1.751

100+ parts

-

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10k+ parts

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811

$1.751

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Northwest PG Solutions

USA . 2,373 parts In-Stock

1+ parts

$1.926

100+ parts

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2,373

$1.926

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MARBEL Systems

Belgium . 1,000 parts In-Stock

1+ parts

$5.980

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1,000

$5.980

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Texas Native Microelectronics

USA . 934 parts In-Stock

1+ parts

$6.874

100+ parts

$6.599

1k+ parts

$6.393

10k+ parts

$6.049

934

$6.874

$6.599

$6.393

$6.049

Kenton Components

USA . 14,784 parts In-Stock

1+ parts

$8.249

100+ parts

-

1k+ parts

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$7.259

14,784

$8.249

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$7.259

Qasali Group International

UK . 900 parts In-Stock

1+ parts

$18.560

100+ parts

-

1k+ parts

$17.261

10k+ parts

$16.333

900

$18.560

-

$17.261

$16.333

Semicontronic

India . 436 parts In-Stock

1+ parts

$147.000

100+ parts

$143.325

1k+ parts

$142.590

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436

$147.000

$143.325

$142.590

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One Stop Electronics

USA . 731 parts In-Stock

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$520.000

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731

$520.000

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Corphita

USA . 1,672 parts In-Stock

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1,672

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Fulton Briggs Corp.

USA . 17 parts In-Stock

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17

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Technical Specifications

ATM/SONET/SDH Circuits DS3104GN-W attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B81

Length:

10 mm

No. of Functions:

1

No. of Terminals:

81

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Maximum Seated Height:

1.47 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

DS3104GN-W Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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