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CAP1214-1-EZK-TR

Microchip Technology

CAP1214-1-EZK-TR by Microchip Technology

CAP1214-1-EZK-TR by Microchip Technology is a surface mount IC with 32 terminals in a square package. It features 14 channels, matte tin finish, and quad terminal position. This analog circuit chip carrier has a very thin profile and is ideal for applications requiring precise control and sensing capabilities.

Median Price

$2.660

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,322 parts In-Stock

1+ parts

$2.660

100+ parts

$2.150

1k+ parts

-

10k+ parts

-

3,322

$2.660

$2.150

-

-

DigiKey

USA . 2,960 parts In-Stock

1+ parts

$2.660

100+ parts

$2.150

1k+ parts

-

10k+ parts

$2.150

2,960

$2.660

$2.150

-

$2.150

Microchip Technology

USA . 1,400 parts In-Stock

1+ parts

$2.660

100+ parts

$2.010

1k+ parts

$1.950

10k+ parts

$1.920

1,400

$2.660

$2.010

$1.950

$1.920

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 1,841 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

$4.220

-

-

-

Rebound Electronics

UK . 659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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659

-

-

-

-

First Choice Components Inc.

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

-

-

-

-

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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39

-

-

-

-

ComSIT Distribution GmbH

Germany . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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22

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 36,948 parts In-Stock

1+ parts

$2.380

100+ parts

$1.940

1k+ parts

$1.880

10k+ parts

$2.380

36,948

$2.380

$1.940

$1.880

$2.380

Futuretech Components

Singapore . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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30,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 23,897 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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23,897

-

-

-

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Lixinc

USA . 18,831 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,831

-

-

-

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RC Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$2.580

1k+ parts

$2.440

10k+ parts

$2.390

9,000

-

$2.580

$2.440

$2.390

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,000

-

-

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Perfect Parts

USA . 7,220 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,220

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-

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A-Z Elektronik GmbH

Germany . 4,872 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,872

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-

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Fulton Briggs Corp.

USA . 4,699 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,699

-

-

-

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Alle Elektronik GmbH

Germany . 3,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,248

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

-

-

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-

Overview

Enhance your electronic designs with the CAP1214-1-EZK-TR by Microchip Technology. Known for their top-quality manufacturing, Microchip Technology delivers innovative solutions in the category of Other Function Semiconductors. This surface mount chip features 14 channels and a sleek square package shape, making it perfect for a variety of applications. With a low seated height and no lead terminal form, this chip offers ease of installation and superior performance. Elevate your projects with the value and benefits that only Microchip Technology can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, reducing the overall size and weight of the product.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on the PCB, simplifying the assembly process.

No. of Terminals: 32

With 32 terminals, this product offers a high level of connectivity and functionality, making it versatile for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design allows for efficient heat dissipation and compact size, ideal for space-constrained applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and conductivity, ensuring reliable connections for optimal performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables the component to be used in slim and compact electronic devices.

Width (mm): 5 mm

The small width of 5mm allows for efficient use of space on the PCB, contributing to a more streamlined and compact device design.

Other IC type: ANALOG CIRCUIT

Being an analog circuit, this product is suitable for applications that require accurate and precise signal processing, making it a dependable choice for analog electronics.

Length: 5 mm

With a length of 5mm, this product offers a compact form factor, ideal for applications where space is limited.

No. of Channels: 14

Having 14 channels allows for multiple signals or data streams to be processed simultaneously, enhancing the product's capability and versatility.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and ensures environmental friendliness, making it a sustainable choice for electronics manufacturing.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on the PCB, increasing overall connectivity and functionality within a limited space.

Technical Specifications

Other Function Semiconductors CAP1214-1-EZK-TR attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

CAP1214-1-EZK-TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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