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AVR128DB64T-I/MR

Microchip Technology

AVR128DB64T-I/MR by Microchip Technology

AVR128DB64T-I/MR by Microchip: 8-bit RISC CPU, 24 MHz clock, 55 I/O lines. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include 22-Ch ADC, 1-Ch DAC, and multiple communication interfaces like SPI and USART.

Median Price

$3.524

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.524

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$3.524

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Vyrian

USA . 8,452 parts In-Stock

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8,452

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VNN

France . 707 parts In-Stock

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707

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,108 parts In-Stock

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$3.000

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Continental Prestige Electronics

USA . 1,057 parts In-Stock

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$3.524

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$3.454

1,057

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$3.454

Argo Parts USA

USA . 647 parts In-Stock

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$3.524

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647

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Netroflash

USA . 500 parts In-Stock

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$3.524

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$3.348

10k+ parts

$3.277

500

$3.524

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$3.348

$3.277

AZTECH Wire

Italy . 759 parts In-Stock

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$10.518

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759

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Semicontronic

India . 1,619 parts In-Stock

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$20.000

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$19.500

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$19.400

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1,619

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Corohmni

South Africa . 37 parts In-Stock

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$28.276

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Aztec Data Supply Inc.

USA . 2,927 parts In-Stock

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$52.120

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West Coast Incorporated

USA . 5,630 parts In-Stock

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5,630

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Overview

Discover the AVR128DB64T-I/MR by Microchip Technology, a cutting-edge microcontroller that offers unparalleled quality and reliability. With a wide range of applications in various industries, this product stands out for its advanced features and performance. From its low power mode to its high clock frequency, this microcontroller is designed to meet the needs of even the most demanding projects. Trust Microchip Technology's expertise and innovation to deliver exceptional value and benefits to your business. Experience the advantages of the AVR128DB64T-I/MR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and cost-effective.

Surface Mount: YES

Being surface mount compatible makes this microcontroller easy to integrate onto PCBs, speeding up the assembly process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

The square package shape helps optimize space on the PCB, making it suitable for compact designs.

Bit Size: 8

The 8-bit architecture allows for quick and efficient processing of data, ideal for many applications.

DAC Channels: YES

The presence of DAC channels enables analog signal output, expanding the microcontroller's functionality.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for external devices and components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered provides flexibility in design and thermal management options.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement makes this microcontroller energy-efficient and suitable for battery-powered applications.

Technical Specifications

Microcontrollers AVR128DB64T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

AVR

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of External Interrupts:

55

No. of I/O Lines:

55

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C(2), SPI(2), TWI(2), USART(6)

Peripherals:

BOD, COMPARATOR(3), CRC, POR, PWM, RTC, TIMER(8), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

AVR128DB64T-I/MR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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