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AVR128DB64-E/MR

Microchip Technology

AVR128DB64-E/MR by Microchip Technology

AVR128DB64-E/MR by Microchip: 8-bit RISC CPU, 55 I/O lines, 22-Ch ADC, 1-Ch DAC. Ideal for automotive applications with -40 to 125 °C operating temp and low power mode. Supports SPI(2), USART(6), PWM channels for versatile connectivity.

Median Price

$2.560

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,420 parts In-Stock

1+ parts

$2.560

100+ parts

$2.130

1k+ parts

$1.960

10k+ parts

$1.860

4,420

$2.560

$2.130

$1.960

$1.860

DigiKey

USA . 88 parts In-Stock

1+ parts

$2.560

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$2.130

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88

$2.560

$2.130

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Nova Conductors

Japan . 10 parts In-Stock

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$2.740

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10

$2.740

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NAC Semi

USA . 3,640 parts In-Stock

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$2.780

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$2.510

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$2.260

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3,640

$2.780

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$2.260

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Tomark Electronics Ltd

UK . 100 parts In-Stock

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$37.740

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100

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Vyrian

USA . 4,622 parts In-Stock

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VNN

France . 1,162 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,357 parts In-Stock

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$2.180

100+ parts

$2.126

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$2.115

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$2.115

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Continental Prestige Electronics

USA . 4,086 parts In-Stock

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$2.740

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$2.685

4,086

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$2.685

Argo Parts USA

USA . 349 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$2.740

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$2.795

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Corohmni

South Africa . 227 parts In-Stock

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$19.869

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Aztec Data Supply Inc.

USA . 4,533 parts In-Stock

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$33.390

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Fulton Briggs Corp.

USA . 2,668 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

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Overview

Unleash the power of innovation with the AVR128DB64-E/MR microcontroller from Microchip Technology. This cutting-edge device boasts a wide range of applications in various industries, offering unparalleled performance and reliability. With advanced features like 22-Ch 12-Bit ADC, 1-Ch 10-Bit DAC, and 8 PWM channels, this microcontroller delivers exceptional value to customers looking to drive their projects to new heights. Trust in Microchip Technology's expertise and experience in the field to revolutionize your next design with the AVR128DB64-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making it ideal for portable and affordable applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and easier automated assembly processes.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options without exceeding safe operating limits.

Package Shape: SQUARE

Square packages offer efficient use of PCB space and alignment with other components.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to interact with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance and efficiency for a wide range of applications.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast data processing and response times in real-time applications.

Connectivity: I2C(2), SPI(2), TWI(2), USART(6)

Multiple communication interfaces enable versatile connections with other devices and systems.

Technical Specifications

Microcontrollers AVR128DB64-E/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

AVR

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of External Interrupts:

55

No. of I/O Lines:

55

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C(2), SPI(2), TWI(2), USART(6)

Peripherals:

BOD, COMPARATOR(3), CRC, POR, PWM, RTC, TIMER(8), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

AVR128DB64-E/MR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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