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ATSAMS70N19B-CFN

Microchip Technology

ATSAMS70N19B-CFN by Microchip Technology

ATSAMS70N19B-CFN by Microchip: Cortex-M7 CPU, 32-bit, 24-bit address bus. Ideal for industrial applications with ADC/DAC channels, 12 timers, low power mode, and extensive connectivity options like USB and UART. Operates at -40 to 105 °C with a max clock frequency of 20 MHz.

Median Price

$12.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 4,160 parts In-Stock

1+ parts

$12.260

100+ parts

$11.120

1k+ parts

$10.170

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4,160

$12.260

$11.120

$10.170

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VNN

France . 5,957 parts In-Stock

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Vyrian

USA . 3,453 parts In-Stock

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3,453

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,034 parts In-Stock

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$10.130

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5,034

$10.130

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Semicontronic

India . 4,993 parts In-Stock

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$10.130

100+ parts

$9.877

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$9.826

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4,993

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$9.877

$9.826

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Vigor

Singapore . 477 parts In-Stock

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$10.130

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477

$10.130

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AZTECH Wire

Italy . 1,073 parts In-Stock

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$22.240

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1,073

$22.240

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Aztec Data Supply Inc.

USA . 3,366 parts In-Stock

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$34.510

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3,366

$34.510

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Corohmni

South Africa . 10 parts In-Stock

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$85.897

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10

$85.897

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,620 parts In-Stock

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Fulton Briggs Corp.

USA . 2,315 parts In-Stock

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Argo Parts USA

USA . 470 parts In-Stock

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470

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Bastille Electronics

Australia . 76 parts In-Stock

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Overview

Experience the cutting-edge technology of the Microchip Technology ATSAMS70N19B-CFN microcontroller, designed to meet the highest quality standards. With a wide range of applications in industries such as automotive, industrial automation, and consumer electronics, this microcontroller offers unparalleled performance and reliability. Benefit from features like integrated cache, low power mode, and a variety of peripherals for seamless connectivity. Trust in Microchip Technology's reputation for excellence and elevate your projects with the ATSAMS70N19B-CFN microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable for easy handling and long-term use.

Integrated Cache: YES

Enhances the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 1.32 V

Provides sufficient power for the microcontroller to operate effectively.

Address Bus Width: 24

Allows for seamless communication between different components in the system.

CPU Family: CORTEX-M7

Utilizes a powerful and efficient CPU architecture for high performance.

ADC Channels: YES

Enables analog-to-digital conversion for accurate sensing and measurement tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers improved performance and efficiency in data processing.

Maximum Clock Frequency: 20 MHz

Allows for fast execution of instructions and operations.

Analog To Digital Convertors: 10-Ch 12-Bit

Provides multiple channels for precise analog signal conversion.

Connectivity: I2SC, QSPI, SPI, SSC, TWI(3), UART(5), USART(3), USB

Offers a wide range of communication interfaces for versatile connectivity options.

Technical Specifications

Microcontrollers ATSAMS70N19B-CFN attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

24

No. of External Interrupts:

1

No. of I/O Lines:

75

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2SC, QSPI, SPI, SSC, TWI(3), UART(5), USART(3), USB

Peripherals:

BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, RTT, TIMER(12), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

ATSAMS70N19B-CFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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