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ATSAMS70J20B-AN

Microchip Technology

ATSAMS70J20B-AN by Microchip Technology

ATSAMS70J20B-AN by Microchip: Cortex-M7 CPU, 32-bit, 1.08-1.32V supply voltage range. Ideal for industrial applications with 24-bit address bus width and integrated cache for enhanced performance. Features include 12 ADC channels, 12 PWM timers, and connectivity options like USB and UART.

Median Price

$11.640

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,400 parts In-Stock

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$11.640

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$9.590

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$8.760

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$8.410

2,400

$11.640

$9.590

$8.760

$8.410

DigiKey

USA . 150 parts In-Stock

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$11.640

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$9.590

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150

$11.640

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Nova Conductors

Japan . 23 parts In-Stock

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$8.951

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$8.951

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NAC Semi

USA . 1,920 parts In-Stock

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$12.000

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$10.880

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$9.950

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Chip Stock

USA . 9,940 parts In-Stock

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Vyrian

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VNN

France . 6,034 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$8.772

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$8.421

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$8.772

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Continental Prestige Electronics

USA . 5,789 parts In-Stock

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$8.951

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$8.772

5,789

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$8.772

Ampacity Inc.

Singapore . 984 parts In-Stock

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$9.890

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Vigor

Singapore . 632 parts In-Stock

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$9.900

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Corohmni

South Africa . 195 parts In-Stock

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$39.320

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Aztec Data Supply Inc.

USA . 257 parts In-Stock

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iodParts Technologies Inc.

India . 8,440 parts In-Stock

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Fulton Briggs Corp.

USA . 6,134 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Argo Parts USA

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Overview

Unlock the full potential of your electronic designs with the ATSAMS70J20B-AN microcontroller from Microchip Technology. Known for their top-quality products, Microchip delivers reliable and innovative solutions for a wide range of applications. This microcontroller boasts advanced features such as integrated cache, multiple ADC and DAC channels, and a high clock frequency of 20 MHz. Whether you're working on industrial automation, consumer electronics, or automotive systems, this powerful microcontroller provides the performance and flexibility you need to bring your projects to life. Elevate your designs with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency.

Maximum Supply Voltage: 1.32 V

Operates efficiently at a relatively low maximum supply voltage.

Address Bus Width: 24

Wide address bus width allows for greater memory addressing capabilities.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability for automotive applications.

Bit Size: 32

32-bit architecture provides enhanced processing power.

DAC Channels: YES

Ability to support Digital-to-Analog Converters for various applications.

Maximum Operating Temperature: 105 °C

Can operate in high-temperature environments, suitable for industrial applications.

ADC Channels: YES

Supports Analog-to-Digital Converters for accurate sensor measurements.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency.

Technical Specifications

Microcontrollers ATSAMS70J20B-AN attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

24

No. of External Interrupts:

1

No. of I/O Lines:

44

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SSC, TWI(2), UART(3), USART(2), USB

Peripherals:

BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, RTT, TIMER(12), WDT

Analog To Digital Convertors:

5-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

ATSAMS70J20B-AN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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