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ATSAME70Q20B-CFN

Microchip Technology

ATSAME70Q20B-CFN by Microchip Technology

Microchip ATSAME70Q20B-CFN is a 32-bit microcontroller with Cortex-M7 CPU, 24 ADC channels, and 12 DMA channels. Ideal for industrial applications, it features a max clock frequency of 20 MHz, 393216 RAM bytes, and connectivity options like CAN, Ethernet, and USB.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 4,744 parts In-Stock

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Vyrian

USA . 1,174 parts In-Stock

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Nova Conductors

Japan . 67 parts In-Stock

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67

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Distributors (Availability)

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Ampacity Inc.

Singapore . 369 parts In-Stock

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$1.000

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369

$1.000

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AZTECH Wire

Italy . 889 parts In-Stock

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$5.891

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889

$5.891

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Vigor

Singapore . 490 parts In-Stock

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$12.930

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$12.930

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Aztec Data Supply Inc.

USA . 295 parts In-Stock

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$14.990

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295

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Semicontronic

India . 909 parts In-Stock

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$31.000

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$30.225

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$30.070

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909

$31.000

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$30.070

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Corohmni

South Africa . 436 parts In-Stock

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$34.552

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QUARKTWIN TECHNOLOGY LTD

USA . 25,162 parts In-Stock

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Microchip USA

USA . 4,762 parts In-Stock

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West Coast Incorporated

USA . 4,609 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,028 parts In-Stock

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Argo Parts USA

USA . 1,590 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Experience the unparalleled performance and reliability of the ATSAME70Q20B-CFN microcontroller from industry leader Microchip Technology. Designed with cutting-edge technology and a wide range of connectivity options, this microcontroller is perfect for a variety of applications in the industrial sector. With low power mode and integrated cache, customers can expect optimal efficiency and speed in their projects. Trust Microchip Technology to deliver top-quality products that exceed expectations, making the ATSAME70Q20B-CFN a smart choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller, ensuring durability and longevity.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller to prevent damage from overvoltage.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for faster data processing and manipulation.

Address Bus Width: 24

A wider address bus allows for greater memory addressing capability, enabling support for larger programs and data sets.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards, making it suitable for automotive applications.

Bit Size: 32

Having a 32-bit architecture provides enhanced performance and processing capabilities compared to lower bit microcontrollers.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, facilitating sensor interfacing and data acquisition.

DAC Channels: YES

Integrated DAC channels enable analog voltage output, useful for controlling analog circuits and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to high-speed operation and efficient processing, making it suitable for real-time applications.

Connectivity: CAN(2), ETHERNET, I2SC(2), QSPI, SPI(2), SSC, TWI(3), UART(5), USART(3), USB

The wide array of connectivity options allows for versatile communication interfaces, enabling integration with various systems and devices.

Technical Specifications

Microcontrollers ATSAME70Q20B-CFN attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B144

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

24

No. of External Interrupts:

1

No. of I/O Lines:

114

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2SC(2), QSPI, SPI(2), SSC, TWI(3), UART(5), USART(3), USB

Peripherals:

BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, RTT, TIMER(12), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

ATSAME70Q20B-CFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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