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ATSAMD51P19A-AF

Microchip Technology

ATSAMD51P19A-AF by Microchip Technology

ATSAMD51P19A-AF by Microchip: 32-bit Cortex-M4F CPU, 196608 RAM bytes, 524288 ROM words. Ideal for automotive applications with CAN, Ethernet, USB connectivity and low power mode support.

Median Price

$6.965

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$6.965

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Vyrian

USA . 4,042 parts In-Stock

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VNN

France . 1,789 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 7,722 parts In-Stock

1+ parts

$5.270

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Corohmni

South Africa . 421 parts In-Stock

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$6.407

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Continental Prestige Electronics

USA . 5,801 parts In-Stock

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$6.756

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$6.621

5,801

$6.756

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$6.621

Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$6.926

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$6.926

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$6.926

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1,000

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$6.926

$6.926

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Netroflash

USA . 100 parts In-Stock

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$6.965

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100

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AZTECH Wire

Italy . 298 parts In-Stock

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$10.547

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Semicontronic

India . 738 parts In-Stock

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$17.000

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$16.575

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$16.490

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738

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$16.490

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Ampacity Inc.

Singapore . 352 parts In-Stock

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$18.000

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Microchip USA

USA . 2,228 parts In-Stock

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$18.659

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Aztec Data Supply Inc.

USA . 3,033 parts In-Stock

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$55.050

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XL Components Corporation

Australia . 8,276 parts In-Stock

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QualityLine Systems

Poland . 7,541 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,435 parts In-Stock

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Argo Parts USA

USA . 1,114 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the ATSAMD51P19A-AF by Microchip Technology. As a leader in microcontrollers, Microchip Technology delivers cutting-edge solutions for a wide range of applications. This high-quality microcontroller offers integrated cache, multiple DAC and ADC channels, and low power mode for optimal efficiency. With its advanced technology and versatile connectivity options, the ATSAMD51P19A-AF is the perfect choice for automotive and industrial projects. Trust Microchip Technology to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having integrated cache helps in improving processing speed and efficiency for the microcontroller.

Maximum Supply Voltage: 3.63 V

Higher supply voltage allows for better performance and functionality of the microcontroller.

No. of External Interrupts: 16

Having multiple external interrupts allows for efficient handling of external events or signals.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

Having a wide range of peripherals enhances the capabilities and versatility of the microcontroller for various applications.

Technical Specifications

Microcontrollers ATSAMD51P19A-AF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

16

No. of I/O Lines:

99

No. of Terminals:

128

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

RAM Words:

196608

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; ISO/TS-16949

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C, LIN, QSPI, USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

ATSAMD51P19A-AF Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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