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ATSAMD51J18A-MUT-EFP

Microchip Technology

ATSAMD51J18A-MUT-EFP by Microchip Technology

ATSAMD51J18A-MUT-EFP by Microchip: 32-bit CORTEX-M4F CPU, 64 terminals, 16 external interrupts. Ideal for industrial applications requiring low power mode and connectivity via CAN, ETHERNET, I2C, LIN, QSPI, USB. Features integrated cache and DAC channels with a max clock frequency of 48 MHz.

Median Price

$6.323

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 24 parts In-Stock

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VNN

France . 5,340 parts In-Stock

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Vyrian

USA . 4,240 parts In-Stock

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Ampacity Inc.

Singapore . 326 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 481 parts In-Stock

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$5.668

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Continental Prestige Electronics

USA . 2,605 parts In-Stock

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$6.197

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Aztec Data Supply Inc.

USA . 206 parts In-Stock

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$17.920

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Microchip USA

USA . 5,901 parts In-Stock

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$31.213

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Corohmni

South Africa . 421 parts In-Stock

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$78.180

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Argo Parts USA

USA . 4,255 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.197

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$6.007

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$5.881

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RGB Technical Solutions

Ukraine . 1,827 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unleash the power of innovation with the Microchip Technology ATSAMD51J18A-MUT-EFP microcontroller. Designed with precision and expertise, this advanced device offers seamless integration, high-speed performance, and versatile connectivity options for a wide range of applications. From industrial automation to IoT devices, this cutting-edge microcontroller delivers unmatched reliability and efficiency. Elevate your projects with the ATSAMD51J18A-MUT-EFP and experience the future of technology today.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache allows for faster access to frequently used data and instructions, enhancing overall performance.

Surface Mount: YES

The surface mount design allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.63 V

A higher maximum supply voltage provides flexibility for various power input requirements in different applications.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data handling and processing within the microcontroller.

Screening Level: ISO/TS-16949

This high screening level ensures that the product meets strict quality and reliability standards, making it a reliable choice for critical applications.

Package Shape: SQUARE

The square package shape offers a compact footprint, maximizing space efficiency on the PCB.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities and performance compared to lower bit sizes.

DAC Channels: YES

The presence of DAC channels allows for analog output capability, enabling versatile control and signal generation.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for interfacing with external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles cater to different mounting and cooling requirements, enhancing versatility in design options.

Technical Specifications

Microcontrollers ATSAMD51J18A-MUT-EFP attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

16

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

ISO/TS-16949

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C, LIN, QSPI, USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

ATSAMD51J18A-MUT-EFP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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