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ATF750C-10GM/883

Microchip Technology

ATF750C-10GM/883 by Microchip Technology

EE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$98.810

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 60 parts In-Stock

1+ parts

$120.740

100+ parts

$93.910

1k+ parts

$83.850

10k+ parts

$67.080

60

$120.740

$93.910

$83.850

$67.080

Arrow

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$96.260

1k+ parts

$87.310

10k+ parts

-

4

-

$96.260

$87.310

-

Verical

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$98.810

1k+ parts

$88.870

10k+ parts

-

4

-

$98.810

$88.870

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 782 parts In-Stock

1+ parts

$88.675

100+ parts

-

1k+ parts

-

10k+ parts

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782

$88.675

-

-

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Vyrian

USA . 8,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,439

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 249 parts In-Stock

1+ parts

$84.008

100+ parts

-

1k+ parts

-

10k+ parts

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249

$84.008

-

-

-

Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$95.041

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

$95.041

-

-

-

Microchip USA

USA . 922 parts In-Stock

1+ parts

$181.111

100+ parts

-

1k+ parts

-

10k+ parts

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922

$181.111

-

-

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Fulton Briggs Corp.

USA . 6,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,999

-

-

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Supply Digital

USA . 620 parts In-Stock

1+ parts

-

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620

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Technical Specifications

Programmable Logic Devices (PLD) ATF750C-10GM/883 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Microchip Technology

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

11 Dedicated Inputs, 10 I/O

Output Function:

Macrocell

No. of Macro Cells:

10

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Maximum Clock Frequency:

83 MHz

Propagation Delay:

10 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Width:

7.62 mm

Length:

32 mm

Maximum Seated Height:

5.08 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T24

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

ATF750C-10GM/883 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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