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AT91SAM9G10-CU

Microchip Technology

AT91SAM9G10-CU by Microchip Technology

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$10.450

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 101 parts In-Stock

1+ parts

$10.450

100+ parts

$8.610

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$7.870

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$7.550

101

$10.450

$8.610

$7.870

$7.550

Distributors (In-Stock)

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Digiode

USA . 733 parts In-Stock

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$9.928

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733

$9.928

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Vyrian

USA . 614 parts In-Stock

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$10.450

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ACDS - Activité Composants Distribution Service

France . 126 parts In-Stock

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Bristol Electronics

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Dan-Mar Components

USA . 126 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 72 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 24 parts In-Stock

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Lakeland Logistics Inc

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Distributors (Availability)

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Corphita

USA . 318 parts In-Stock

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$9.405

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A-Z Elektronik GmbH

Germany . 9,818 parts In-Stock

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GreenTree Electronics

Israel . 9,000 parts In-Stock

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West Coast Incorporated

USA . 5,776 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,418 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,824 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Metaverse IC Inc.

Canada . 3,109 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Supply Digital

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Microchip USA

USA . 140 parts In-Stock

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Kepictronics

USA . 139 parts In-Stock

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Technical Specifications

Microcontrollers AT91SAM9G10-CU attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

NO

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM9

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B217

Length:

15 mm

Low Power Mode:

YES

No. of DMA Channels:

19

No. of External Interrupts:

3

No. of I/O Lines:

96

No. of Serial I/Os:

1

No. of Terminals:

217

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA217,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8/3.3,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

266 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Connectivity:

I2C(2), SDMMC, SPI(2), SSC(3), USART(3), USB

Peripherals:

DMA(19), POR, RTC, RTT, TIMER(4), WDT

Trade Compliance

AT91SAM9G10-CU Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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