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AT89C5130A-RDRUM

Microchip Technology

AT89C5130A-RDRUM by Microchip Technology

AT89C5130A-RDRUM by Microchip: 5.5V max supply, 48MHz clock, 1024 RAM bytes. Ideal for industrial applications requiring low power consumption and connectivity via EUART, SPI, TWI, USB.

Median Price

$4.040

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 723 parts In-Stock

1+ parts

$4.040

100+ parts

$3.960

1k+ parts

$3.880

10k+ parts

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723

$4.040

$3.960

$3.880

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,222 parts In-Stock

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5,222

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Chip Stock

USA . 2,536 parts In-Stock

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2,536

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VNN

France . 1,802 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Vigor

Singapore . 1,491 parts In-Stock

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$5.400

100+ parts

-

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1,491

$5.400

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Semicontronic

India . 1,081 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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1,081

$6.000

$5.850

$5.820

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Corohmni

South Africa . 185 parts In-Stock

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$9.090

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185

$9.090

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AZTECH Wire

Italy . 369 parts In-Stock

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$11.610

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369

$11.610

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

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$30.000

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$30.000

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Marpe Global Electronics

Taiwan . 5,605 parts In-Stock

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QualityLine Systems

Poland . 2,972 parts In-Stock

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iodParts Technologies Inc.

India . 1,200 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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XL Components Corporation

Australia . 514 parts In-Stock

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514

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Netroflash

USA . 50 parts In-Stock

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Overview

Unlock the power of innovation with the AT89C5130A-RDRUM microcontroller by industry leader Microchip Technology. Designed for a wide range of applications, this cutting-edge device offers customers unmatched value and performance. With features like low power mode, flash ROM programmability, and connectivity options including SPI and USB, the AT89C5130A-RDRUM delivers on both quality and capability. Trust Microchip Technology to provide top-of-the-line solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options, allowing for compatibility with a range of applications.

On Chip Data RAM Width: 8

Sufficient amount of on-chip RAM for storing data and variables during operation, enhancing performance.

Address Bus Width: 16

Wide address bus allows for accessing a large memory space, enabling complex computing tasks.

Package Shape: SQUARE

Square shape facilitates easy placement and routing on PCBs, optimizing space utilization.

Bit Size: 8

8-bit architecture enables efficient data processing and control tasks, suitable for many applications.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components and interfaces, enhancing connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Stylish and compact package design with fine pitch for improved handling and soldering capabilities.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage allows for operation in low-power scenarios, reducing power consumption.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications with varying ambient conditions.

CPU Family: 80C51

Belonging to the popular 80C51 CPU family ensures compatibility with a wide range of development tools and software libraries.

No. of External Interrupts: 2

Multiple external interrupt pins enable the microcontroller to respond to external events promptly, enhancing its real-time capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function reliably in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish on terminals enhances solderability and ensures reliable electrical connections.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and assembly, reducing design complexity and manufacturing costs.

ROM Words: 16384

Large ROM capacity allows for storing program instructions, enabling the microcontroller to run complex software applications.

Maximum Seated Height: 1.6 mm

Low profile design with a compact height profile saves space in electronic devices and allows for slim form factors.

Width: 10 mm

Compact width dimension makes the microcontroller suitable for space-constrained applications without compromising on performance.

Data EEPROM Size: 4096

Sufficient EEPROM size for non-volatile data storage, allowing for storing critical data even when power is disconnected.

External Data Bus Width: 8

Data bus width of 8 bits provides efficient data transfer between the microcontroller and external memory or peripherals.

Peripherals: POR, PWM, TIMER(2), WDT

Integrated peripherals such as Power-On Reset, PWM, Timers, and Watchdog Timer enhance the microcontroller's functionality for diverse applications.

Maximum Clock Frequency: 48 MHz

High clock frequency support enables fast execution of instructions, improving overall system performance.

Length: 10 mm

Compact length dimension contributes to a small overall footprint, suitable for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature conditions, ensuring reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller functionality simplifies system design and reduces the need for external components, saving cost and space.

No. of Timers: 2

Multiple timers allow for precise timing control in applications such as event scheduling and PWM generation.

RAM Bytes: 1024

Adequate on-chip RAM size for temporary data storage, enhancing the microcontroller's processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mount assembly and enhances solder joint reliability.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage ensures compatibility with common power sources and reduces the need for additional voltage regulation.

PWM Channels: YES

Built-in PWM channels enable precise control of pulse-width modulation signals for applications such as motor control and LED dimming.

Connectivity: EUART, SPI, TWI, USB

Support for multiple communication interfaces such as Enhanced UART, SPI, Two-Wire Interface, and USB enhances connectivity options for external devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and reprogramming, enhancing the flexibility and versatility of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and improves signal integrity in compact electronic designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and numerical calculations, making the microcontroller suitable for applications with fixed precision requirements.

Speed: 48 rpm

High processing speed of 48 rpm enables fast data processing and response times, improving system performance in real-time applications.

Low Power Mode: YES

Low power mode feature allows the microcontroller to conserve energy during idle or standby periods, extending battery life in portable devices.

On Chip Program ROM Width: 8

Wide on-chip program ROM width of 8 bits supports storing a large number of program instructions, enabling the execution of complex software algorithms.

No. of I/O Lines: 34

Sufficient number of input/output lines for interfacing with external sensors, actuators, and peripherals, enhancing the microcontroller's versatility in system integration.

Technical Specifications

Microcontrollers AT89C5130A-RDRUM attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

CPU Family:

80C51

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

2

No. of I/O Lines:

34

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

EUART, SPI, TWI, USB

Peripherals:

POR, PWM, TIMER(2), WDT

Trade Compliance

AT89C5130A-RDRUM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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