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93C66AT-E/SN

Microchip Technology

93C66AT-E/SN by Microchip Technology

93C66AT-E/SN by Microchip Technology is a 512x8 EEPROM with 1MHz clock frequency, operating from -40 to 125°C. It features software write protection, MICROWIRE serial bus type, and 1000000 write/erase cycles. Ideal for automotive applications due to TS16949 screening level and small outline package style.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 26,400 parts In-Stock

1+ parts

$0.430

100+ parts

$0.410

1k+ parts

$0.370

10k+ parts

$0.350

26,400

$0.430

$0.410

$0.370

$0.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 19,800 parts In-Stock

1+ parts

$0.450

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

-

19,800

$0.450

$0.400

$0.360

-

Bristol Electronics

USA . 4,622 parts In-Stock

1+ parts

$1.062

100+ parts

$0.425

1k+ parts

$0.297

10k+ parts

$0.276

4,622

$1.062

$0.425

$0.297

$0.276

Dan-Mar Components

USA . 4,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,622

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 54,796 parts In-Stock

1+ parts

$0.400

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

$0.310

54,796

$0.400

$0.400

$0.360

$0.310

QUARKTWIN TECHNOLOGY LTD

USA . 26,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,406

-

-

-

-

Kepictronics

USA . 19,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,791

-

-

-

-

West Coast Incorporated

USA . 7,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,774

-

-

-

-

Overview

Discover the cutting-edge technology of the Microchip Technology 93C66AT-E/SN EEPROM, designed to meet the highest quality standards and deliver exceptional performance. Ideal for automotive applications, this small outline memory module offers 512x8 organization and software write protection. With a maximum endurance of 1,000,000 write/erase cycles and a low standby current of 0.000005 Amp, this EEPROM provides reliable data storage and retrieval while maximizing energy efficiency. Trust in the unmatched expertise of Microchip Technology to enhance your automotive electronics with the 93C66AT-E/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and enabling efficient production processes.

Nominal Supply Voltage / Vsup (V): 2.5

Operates efficiently at a moderate voltage, suitable for a variety of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial environments.

Organization: 512X8

Offers a good balance between memory size and organization for storing data efficiently.

Write Protection: SOFTWARE

Provides security for the stored data by allowing software-based protection mechanisms.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the manufacturing process, ensuring reliable solder connections.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, enhancing overall performance.

Endurance: 1000000 Write/Erase Cycles

Offers a high number of write/erase cycles, ensuring longevity and reliability for frequent data updates.

Maximum Standby Current: 0.000005 Amp

Consumes very low standby current, conserving power and extending battery life in portable devices.

Technical Specifications

EEPROM 93C66AT-E/SN attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

YES

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

2 ms

Write Protection:

SOFTWARE

Trade Compliance

93C66AT-E/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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