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34AA02T-E/MNY

Microchip Technology

34AA02T-E/MNY by Microchip Technology

34AA02T-E/MNY by Microchip Technology is an EEPROM with 256x8 organization, operating at 2.5V, and featuring I2C control byte 1010DDDR. Ideal for automotive applications, it offers a max clock frequency of 0.4 MHz, endurance of 1M cycles, and operates in the temperature range of -40 to 125°C.

Median Price

$0.445

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 12,750 parts In-Stock

1+ parts

$0.430

100+ parts

$0.410

1k+ parts

$0.370

10k+ parts

$0.350

12,750

$0.430

$0.410

$0.370

$0.350

Mouser Electronics

USA . 5,576 parts In-Stock

1+ parts

$0.460

100+ parts

-

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5,576

$0.460

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 6,600 parts In-Stock

1+ parts

$0.450

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

-

6,600

$0.450

$0.400

$0.360

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Vyrian

USA . 3,320 parts In-Stock

1+ parts

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3,320

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VNN

France . 920 parts In-Stock

1+ parts

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920

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,034 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

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13,034

$0.365

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$8.660

100+ parts

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451

$8.660

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West Coast Incorporated

USA . 5,846 parts In-Stock

1+ parts

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5,846

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock endless possibilities with the 34AA02T-E/MNY EEPROM by Microchip Technology. This high-quality memory IC offers unrivaled performance and reliability, making it the ideal choice for a wide range of automotive applications. With its advanced features and durable construction, this EEPROM ensures seamless operation and data retention, giving you peace of mind knowing your valuable information is secure. Experience the convenience and efficiency of the 34AA02T-E/MNY and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the EEPROM, making it suitable for various environments.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures efficient power consumption and compatibility with standard voltage levels.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this EEPROM can withstand high heat conditions, making it suitable for automotive applications.

Organization: 256X8

With an organization of 256 words of 8 bits each, this EEPROM offers sufficient memory capacity for storing data efficiently.

I2C Control Byte: 1010DDDR

Utilizing an I2C control byte format allows for easy interfacing with other devices on the same bus, enabling seamless communication.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during the manufacturing process, guaranteeing robust connections.

Endurance: 1000000 Write/Erase Cycles

The EEPROM's high endurance of 1,000,000 write/erase cycles ensures long-lasting reliability and data retention for frequent usage.

Serial Bus Type: I2C

Being compatible with the I2C serial bus type allows for easy integration with other I2C-compatible devices, simplifying system design.

Technical Specifications

EEPROM 34AA02T-E/MNY attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

34AA02T-E/MNY Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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