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24LC01B-I/SNG

Microchip Technology

24LC01B-I/SNG by Microchip Technology

24LC01B-I/SNG by Microchip Technology is a small outline EEPROM with 128x8 organization, I2C control byte, and hardware write protection. It operates at 5V with a max clock frequency of 0.4 MHz. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,397 parts In-Stock

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7,397

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Nova Conductors

Japan . 85 parts In-Stock

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85

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VNN

France . 25 parts In-Stock

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25

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Aztec Data Supply Inc.

USA . 129 parts In-Stock

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$4.019

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129

$4.019

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Andel Nordic

Denmark . 5,001 parts In-Stock

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$9.786

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$9.395

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$9.395

5,001

$9.786

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$9.395

$9.395

AZTECH Wire

Italy . 812 parts In-Stock

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$16.471

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Ampacity Inc.

Singapore . 979 parts In-Stock

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$18.000

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979

$18.000

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Semicontronic

India . 1,133 parts In-Stock

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$27.000

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$26.325

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$26.190

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1,133

$27.000

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$26.190

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Lixinc

USA . 13,142 parts In-Stock

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West Coast Incorporated

USA . 4,923 parts In-Stock

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Continental Prestige Electronics

USA . 3,115 parts In-Stock

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Argo Parts USA

USA . 2,483 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Microchip USA

USA . 363 parts In-Stock

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363

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Overview

Unlock the power of reliable data storage with the 24LC01B-I/SNG by Microchip Technology, a top-tier EEPROM that offers exceptional quality and performance. Perfect for industrial applications, this small outline package provides a robust solution for your memory needs. With up to 1000000 write/erase cycles and a wide temperature range, this EEPROM ensures lasting durability and functionality. Trust in Microchip's expertise and elevate your projects with the 24LC01B-I/SNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the EEPROM.

Surface Mount: YES

Makes it easy to integrate the EEPROM into printed circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 5V

Compatible with standard voltage levels, making it versatile for a wide range of applications.

Memory Density: 1024 bit

Provides ample storage capacity for storing critical data and information.

Technology: CMOS

Offers low power consumption and high noise immunity, ensuring reliable operation.

Endurance: 1000000 Write/Erase Cycles

Guarantees long-term reliability and durability for frequent read/write operations.

Serial Bus Type: I2C

Facilitates easy communication with other devices, enhancing connectivity and interoperability.

Technical Specifications

EEPROM 24LC01B-I/SNG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010XXXR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Reverse Pinout:

NO

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC01B-I/SNG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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