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24C02CT-I/MC

Microchip Technology

24C02CT-I/MC by Microchip Technology

24C02CT-I/MC by Microchip Technology is a 256x8 EEPROM with I2C control byte. Operating at 5V, it offers 1000000 write/erase cycles and has a memory density of 2048 bits. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$0.545

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.629

100+ parts

-

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10

$0.629

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Bristol Electronics

USA . 3,005 parts In-Stock

1+ parts

-

100+ parts

$0.461

1k+ parts

$0.344

10k+ parts

$0.320

3,005

-

$0.461

$0.344

$0.320

Dan-Mar Components

USA . 3,005 parts In-Stock

1+ parts

-

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3,005

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Vyrian

USA . 2,124 parts In-Stock

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2,124

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VNN

France . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,902 parts In-Stock

1+ parts

$0.629

100+ parts

-

1k+ parts

-

10k+ parts

$0.616

4,902

$0.629

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-

$0.616

Argo Parts USA

USA . 1,856 parts In-Stock

1+ parts

$0.629

100+ parts

-

1k+ parts

-

10k+ parts

$0.610

1,856

$0.629

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-

$0.610

Ampacity Inc.

Singapore . 502 parts In-Stock

1+ parts

$0.870

100+ parts

-

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502

$0.870

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AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$18.544

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417

$18.544

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Marpe Global Electronics

Taiwan . 5,212 parts In-Stock

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5,212

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XL Components Corporation

Australia . 4,034 parts In-Stock

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4,034

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QualityLine Systems

Poland . 2,435 parts In-Stock

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2,435

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Perfect Parts

USA . 1,099 parts In-Stock

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1,099

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Overview

Unlock the power of reliable data storage with the 24C02CT-I/MC by Microchip Technology. This high-quality EEPROM offers unparalleled endurance with 1,000,000 write/erase cycles, ensuring long-lasting performance in industrial applications. With a compact design and versatile I2C serial bus interface, this memory IC is perfect for a wide range of devices. Trust in Microchip Technology's expertise and experience to deliver a dependable solution for all your data storage needs. Experience the value and reliability that only Microchip can provide with the 24C02CT-I/MC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

A consistent supply voltage of 5V helps maintain stable operation and data retention in the EEPROM.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can withstand harsh environmental conditions.

Endurance: 1,000,000 Write/Erase Cycles

The high endurance level ensures that the EEPROM can be written to and erased numerous times without degradation in performance.

Memory Density: 2048 bit

The EEPROM's high memory density allows for storing a large amount of data in a compact form factor.

Serial Bus Type: I2C

The I2C bus interface provides a simple and efficient way to communicate with the EEPROM, making it easy to integrate into various systems.

Technical Specifications

EEPROM 24C02CT-I/MC attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2 mm

Maximum Write Cycle Time (tWC):

1 ms

Write Protection:

HARDWARE

Trade Compliance

24C02CT-I/MC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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