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24AA64-E/SM

Microchip Technology

24AA64-E/SM by Microchip Technology

24AA64-E/SM by Microchip Technology is an EEPROM with 8KX8 organization, 65536 bit memory density, and 1000000 Write/Erase Cycles endurance. It operates in synchronous mode at a max clock frequency of 0.4 MHz. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125 °C operating temperature range.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 760 parts In-Stock

1+ parts

$0.610

100+ parts

$0.580

1k+ parts

$0.540

10k+ parts

$0.500

760

$0.610

$0.580

$0.540

$0.500

Mouser Electronics

USA . 430 parts In-Stock

1+ parts

$0.650

100+ parts

$0.617

1k+ parts

-

10k+ parts

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430

$0.650

$0.617

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.615

100+ parts

-

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50

$0.615

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Vyrian

USA . 6,244 parts In-Stock

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VNN

France . 4,495 parts In-Stock

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4,495

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Distributors (Availability)

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Ampacity Inc.

Singapore . 395 parts In-Stock

1+ parts

$0.520

100+ parts

-

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395

$0.520

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$0.615

100+ parts

$0.584

1k+ parts

$0.555

10k+ parts

$0.547

100

$0.615

$0.584

$0.555

$0.547

Ledger Components

France . 7,642 parts In-Stock

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7,642

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LOOK Integrated Logistics

Peru . 6,749 parts In-Stock

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6,749

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LMD Electronica

Estonia . 3,990 parts In-Stock

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3,990

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Montano Global Distributors

Canada . 1,747 parts In-Stock

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1,747

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NIA Electronics

USA . 1,642 parts In-Stock

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1,642

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Overview

Unlock endless possibilities with the 24AA64-E/SM by Microchip Technology, a high-quality EEPROM that guarantees reliability and performance. Designed for automotive applications, this small outline package offers 8Kx8 organization, 1000000 write/erase cycles endurance, and I2C serial bus type for seamless connectivity. With an operating temperature range from -40°C to 125°C, this EEPROM ensures data retention time of 200 years, making it the perfect choice for your automotive memory needs. Experience the value and benefits of superior technology with the 24AA64-E/SM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various environmental conditions.

Nominal Supply Voltage / Vsup (V) 4.5

This voltage level is typical for many electronic systems, ensuring compatibility with a wide range of applications.

Memory Density: 65536 bit

The high memory density allows for storing a large amount of data in a compact EEPROM, making it efficient for space-constrained designs.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating ensures a long lifespan for the EEPROM, making it reliable for frequent read/write operations.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and control of data transfer, enhancing the overall performance of the EEPROM.

Serial Bus Type: I2C

The I2C interface enables easy communication with other devices, simplifying integration into a wider system and improving overall efficiency.

Technical Specifications

EEPROM 24AA64-E/SM attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-J8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.10

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

4.5

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA64-E/SM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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