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15KPA130CAE3/TR13

Microchip Technology

15KPA130CAE3/TR13 by Microchip Technology

15KPA130CAE3/TR13 by Microchip is a single transient suppression device with a max power dissipation of 15000W. It operates in temperatures ranging from -55 to 175°C and has a bidirectional polarity. Ideal for applications requiring high breakdown voltages and avalanche technology for surge protection.

Median Price

$12.717

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$12.717

100+ parts

-

1k+ parts

-

10k+ parts

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150

$12.717

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VNN

France . 27,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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27,624

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Vyrian

USA . 637 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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637

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 293 parts In-Stock

1+ parts

$0.025

100+ parts

-

1k+ parts

-

10k+ parts

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293

$0.025

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Aztec Data Supply Inc.

USA . 3,471 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

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3,471

$0.039

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Semicontronic

India . 1,543 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

1k+ parts

$0.980

10k+ parts

-

1,543

$1.010

$0.985

$0.980

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Ampacity Inc.

Singapore . 226 parts In-Stock

1+ parts

$2.010

100+ parts

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226

$2.010

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Continental Prestige Electronics

USA . 1,017 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

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10k+ parts

$12.211

1,017

$12.460

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$12.211

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$12.462

100+ parts

-

1k+ parts

$11.964

10k+ parts

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2,000

$12.462

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$11.964

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AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$13.316

100+ parts

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637

$13.316

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Argo Parts USA

USA . 4,481 parts In-Stock

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4,481

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RGB Technical Solutions

Ukraine . 4,368 parts In-Stock

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4,368

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Overview

Upgrade your electronics with the 15KPA130CAE3/TR13 by Microchip Technology, a top-of-the-line Transient Suppression Device that guarantees high-quality performance and reliability. Whether you're looking to protect sensitive components from voltage spikes or ensure smooth operations in harsh environments, this product has got you covered. With its advanced technology and durable construction, this device offers unmatched value and peace of mind for all your application needs. Trust Microchip Technology to deliver superior products that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the device is lightweight and resistant to impact and thermal shock, making it a durable and reliable choice for transient suppression.

Maximum Non Repetitive Peak Reverse Power Dissipation: 15000 W

With high power dissipation capability, this device can effectively handle large transient surges or spikes, providing robust protection for sensitive electronics.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this device to function effectively in various environmental conditions, ensuring continuous protection against transients.

Minimum Breakdown Voltage: 145.2 V

The low minimum breakdown voltage ensures that the device activates quickly to suppress transient overvoltages and protect connected equipment from potential damage.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of Trans Voltage Suppressor Diode technology ensures efficient and reliable transient suppression capabilities, safeguarding sensitive electronics from voltage spikes and surges.

Technical Specifications

Transient Suppression Devices 15KPA130CAE3/TR13 attributes and parameters. Explore more Transient Suppression Devices devices from Microchip Technology

Specs

Maximum Breakdown Voltage:

152.46 V

Minimum Breakdown Voltage:

145.2 V

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

O-PALF-W2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

15000 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

8 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

130 V

Surface Mount:

NO

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

15KPA130CAE3/TR13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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