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MICRF113YM6

Micrel

MICRF113YM6 by Micrel

CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,500 parts In-Stock

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10,500

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Bristol Electronics

USA . 3,005 parts In-Stock

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3,005

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NexGen Digital

USA . 1,968 parts In-Stock

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1,968

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LWI Electronics Inc

India . 9 parts In-Stock

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9

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Distributors (Availability)

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A-Z Elektronik GmbH

Germany . 8,376 parts In-Stock

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8,376

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S.R.D Solutions

India . 5,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,153 parts In-Stock

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Technical Specifications

Other Function Consumer ICs MICRF113YM6 attributes and parameters. Explore more Other Function Consumer ICs devices from Micrel

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

MICRF113YM6 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Micrel

Micrel has been acquired by Microchip Technology Inc., a leading provider of mixed-signal, analog and Flash-IP solutions that offers low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Micrel, Inc. is a leading global manufacturer of IC solutions for the worldwide high-performance linear and power, LAN and timing and communications markets. The Company’s products include advanced mixed-signal, analog and power semiconductors, as well as high-performance communication, clock management, Ethernet switch and physical layer transceiver ICs. Company customers include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products. Corporation headquarters and state-of-the-art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and advanced technology design centers situated throughout the Americas, Europe and Asia. In addition, the Company maintains an extensive network of distributors and reps worldwide.

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