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DS3170N+

Maxim Integrated

DS3170N+ by Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 634 parts In-Stock

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Anansix

USA . 498 parts In-Stock

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Digiode

USA . 144 parts In-Stock

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Electronics Depot

USA . 3 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 49 parts In-Stock

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$0.111

100+ parts

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$0.107

49

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$0.107

Northwest PG Solutions

USA . 37 parts In-Stock

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$0.122

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$0.108

37

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$0.108

MARBEL Systems

Belgium . 501 parts In-Stock

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$13.106

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501

$13.106

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Texas Native Microelectronics

USA . 1,000 parts In-Stock

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$15.064

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$14.461

1k+ parts

$14.010

10k+ parts

$13.256

1,000

$15.064

$14.461

$14.010

$13.256

Kenton Components

USA . 772 parts In-Stock

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$18.077

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$15.908

772

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$15.908

Qasali Group International

UK . 4,573 parts In-Stock

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$40.673

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$40.673

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One Stop Electronics

USA . 1,321 parts In-Stock

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$333.000

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$333.000

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Semicontronic

India . 564 parts In-Stock

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$940.000

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$916.500

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$911.800

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QUARKTWIN TECHNOLOGY LTD

USA . 7,615 parts In-Stock

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Corphita

USA . 744 parts In-Stock

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Vigor

Singapore . 546 parts In-Stock

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Microchip USA

USA . 350 parts In-Stock

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350

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Kepictronics

USA . 294 parts In-Stock

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294

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Technical Specifications

Digital Transmission Controllers DS3170N+ attributes and parameters. Explore more Digital Transmission Controllers devices from Maxim Integrated

Specs

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.145 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

11 mm

Trade Compliance

DS3170N+ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

-

489,000

-

Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

-

312,000

-

Fabrication

Fab Initiation

-

Thailand

Chon Buri

Wafer Capacity

194,000

-

194,000

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