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DS26401NA2+

Maxim Integrated

DS26401NA2+ by Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,381 parts In-Stock

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Digiode

USA . 1,362 parts In-Stock

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Vyrian

USA . 317 parts In-Stock

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317

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Native Components

USA . 607 parts In-Stock

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$0.791

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607

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Northwest PG Solutions

USA . 1,209 parts In-Stock

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$0.870

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$0.870

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MARBEL Systems

Belgium . 4,270 parts In-Stock

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$11.688

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$11.688

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$13.434

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$12.897

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$12.494

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$11.822

450

$13.434

$12.897

$12.494

$11.822

Kenton Components

USA . 945 parts In-Stock

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$16.121

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$14.186

945

$16.121

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Qasali Group International

UK . 508 parts In-Stock

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$36.272

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$33.733

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$31.919

508

$36.272

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$33.733

$31.919

One Stop Electronics

USA . 795 parts In-Stock

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$116.000

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$116.000

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Semicontronic

India . 785 parts In-Stock

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$172.000

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$167.700

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$166.840

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$172.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,772 parts In-Stock

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Microchip USA

USA . 5,905 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,411 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Vigor

Singapore . 712 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Corphita

USA . 471 parts In-Stock

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471

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Kepictronics

USA . 87 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1 parts In-Stock

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Technical Specifications

Digital Transmission Controllers DS26401NA2+ attributes and parameters. Explore more Digital Transmission Controllers devices from Maxim Integrated

Specs

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Trade Compliance

DS26401NA2+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

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489,000

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Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

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312,000

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Fabrication

Fab Initiation

-

Thailand

Chon Buri

Wafer Capacity

194,000

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194,000

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