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ICE40UP3K-UWG30ITR1K

Lattice Semiconductor

ICE40UP3K-UWG30ITR1K by Lattice Semiconductor

ICE40UP3K-UWG30ITR1K by Lattice Semiconductor is a Field Programmable Gate Array with 2800 logic cells and 350 CLBs. Operating at 1.2V, it features a max combinatorial delay of 9ns. Ideal for applications requiring high-speed processing in compact designs.

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Overview

Unleash the power of cutting-edge technology with the ICE40UP3K-UWG30ITR1K by Lattice Semiconductor. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Lattice Semiconductor delivers top-quality products that exceed industry standards. This FPGA offers 2800 logic cells and 350 CLBs, providing unmatched flexibility and performance for a wide range of applications. With a nominal supply voltage of 1.2V and a maximum operating temperature of 100°C, this FPGA is designed to meet the demands of today's rapidly evolving technology landscape. Experience the value and benefits of the ICE40UP3K-UWG30ITR1K and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides a good balance of cost-effectiveness and durability for the FPGA.

No. of Logic Cells: 2800

With 2800 logic cells, this FPGA offers a high level of flexibility and customization for different types of designs.

Surface Mount: YES

The surface mount capability makes it easier to integrate this FPGA onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures compatibility with a wide range of power supply configurations.

Technology Used: CMOS

The use of CMOS technology in this FPGA helps to minimize power consumption and heat dissipation, making it more energy-efficient.

No. of Inputs: 21

With 21 inputs, this FPGA can accommodate a variety of input signals and data sources for complex designs.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to work with, allowing for straightforward integration into different types of systems.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and ensures reliable connections in the finished product.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V is a common standard in many electronic devices, providing compatibility with various power sources.

Packing Method: TR

The TR packing method helps to protect the FPGA during shipping and handling, reducing the risk of damage before installation.

No. of Terminals: 30

With 30 terminals, this FPGA can support a sufficient number of connections for typical applications without being overly complex.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable gate array, this device offers a high level of flexibility and reconfigurability for a wide range of applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch allows for high-density mounting and efficient use of space on circuit boards.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures reliable operation even under low-power conditions, enhancing the overall reliability of the system.

Maximum Operating Temperature: 100 °C

The FPGA can operate at temperatures up to 100°C, making it suitable for a wide range of environments and applications.

Pitch Of Terminal: 0.4 mm

The 0.4 mm pitch of the terminals allows for precise connections and compatibility with standard manufacturing processes for electronic components.

Maximum Combinatorial Delay of a CLB: 9 ns

The maximum combinatorial delay of 9 ns ensures fast processing and response times for real-time applications that require quick decision-making.

Organization: 350 CLBS

With 350 configurable logic blockS (CLBs), this FPGA provides a high degree of customization and adaptability for diverse design requirements.

Minimum Operating Temperature: -40 °C

The FPGA is rated for operation down to -40°C, ensuring reliable performance even in extreme cold environments.

Position Of Terminal: BOTTOM

The placement of terminals on the bottom side of the package helps to streamline the routing of traces and connections on the circuit board.

Maximum Seated Height: 0.6 mm

With a maximum seated height of 0.6 mm, this FPGA can be mounted flush to the PCB, reducing overall system profile and improving compactness.

Width: 2.114 mm

The compact width of 2.114 mm allows for efficient use of space on the circuit board and facilitates tight integration into small form factor devices.

No. of Outputs: 21

The FPGA offers 21 output channels for transmitting processed data and signals, enabling complex data processing and communication capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FPGA can withstand the rigors of the assembly process without degradation.

Peak Reflow Temperature °C: 260

The FPGA can endure the high temperatures of peak reflow (260°C), ensuring proper soldering and reliability in manufacturing.

Length: 2.537 mm

The length of 2.537 mm provides a compact footprint for the FPGA, allowing for efficient use of space on the circuit board and enabling high-density designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) ICE40UP3K-UWG30ITR1K attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2800

No. of Inputs:

21

No. of Outputs:

21

No. of CLBs:

350

CLB Maximum Delay:

9 ns

Technology:

CMOS

Organization:

350 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

1

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

2.537 mm

Width:

2.114 mm

Maximum Seated Height:

.6 mm

Packing Method:

Tape and Reel

Package Equivalence Code:

BGA30,5X6,16

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.4 mm

No. of Terminals:

30

Standards

JESD-30 Code:

R-PBGA-B30

Trade Compliance

ICE40UP3K-UWG30ITR1K Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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