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CWR29HC226KCGC

KEMET Corporation

CWR29HC226KCGC by KEMET Corporation

CWR29HC226KCGC by KEMET Corp is a TANTALUM CAPACITOR with 22uF capacitance, 15V URdc, and 269.6mA ripple current. Ideal for MIL-PRF-55365/11 applications requiring compact SMT design with -55 to 125 °C operating range. Features low Tan Delta of 0.06 and ESR of 275mohm for reliable performance in various electronic devices.

Median Price

$25.080

Lifecycle Status

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< 1k

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Chip1Stop

Japan . 183 parts In-Stock

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$23.360

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$23.360

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Arrow

USA . 53 parts In-Stock

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$25.080

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$24.330

10k+ parts

$24.090

53

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$24.330

$24.090

Verical

USA . 53 parts In-Stock

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100+ parts

$25.080

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$24.330

10k+ parts

$24.090

53

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$25.080

$24.330

$24.090

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 8 parts In-Stock

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AZTECH Wire

Italy . 866 parts In-Stock

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Ampacity Inc.

Singapore . 183 parts In-Stock

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$18.850

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Aranea Global

USA . 100 parts In-Stock

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$22.716

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$21.808

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Continental Prestige Electronics

USA . 4,005 parts In-Stock

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Argo Parts USA

USA . 1,498 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the CWR29HC226KCGC tantalum capacitor by KEMET Corporation. This top-of-the-line fixed capacitor is designed to provide superior performance in a wide range of applications. From its high ripple current capability to its low leakage current, this capacitor offers unmatched value and benefits to customers seeking a dependable solution for their electronic needs. Trust KEMET Corporation to deliver excellence in every component, ensuring your projects run smoothly and efficiently.

Feature Benefit Bullets

Dielectric Material: TANTALUM (DRY/SOLID)

Tantalum is known for its high capacitance values and stable performance, making this capacitor reliable for various applications.

Tan Delta: 0.06

Low tan delta indicates low dielectric loss, resulting in efficient energy storage and minimal heat generation.

Leakage Current (mA): 0.004

Low leakage current ensures minimal power loss and improved efficiency of the capacitor.

Package Shape: RECTANGULAR PACKAGE

Rectangular package shape allows for easy and efficient installation in circuit boards.

Ripple Current (mA): 269.6

High ripple current handling capability makes this capacitor suitable for applications with fluctuating voltage levels.

Terminal Finish: Tin/Lead (Sn90Pb10)

Tin/lead terminal finish provides good solderability and reliability in various soldering processes.

Capacitance: 22 uF

With a capacitance of 22uF, this capacitor can store and release a sufficient amount of charge for smooth operation of electronic circuits.

Technical Specifications

Fixed Capacitors CWR29HC226KCGC attributes and parameters. Explore more Fixed Capacitors devices from KEMET Corporation

Specs

Additional Features:

ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

Capacitance:

Capacitor Type:

Dielectric Material:

Equivalent Series Resistance / ESR (mohm ):

275

Height:

2.79 mm

JESD-609 Code:

e0

Leakage Current (mA):

0.004

Length:

6.73 mm

Mounting Feature:

Negative Tolerance:

10 %

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Package Shape:

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Packing Method:

TR, EMBOSSED PLASTIC, 7 INCH

Polarity:

POLARIZED

Positive Tolerance:

10 %

Rated DC Voltage (URdc):

Reference Standard:

MIL-PRF-55365/11

Ripple Current (mA):

269.6

Size Code:

2711

Tan Delta:

0.06

Terminal Finish:

Tin/Lead (Sn90Pb10)

Terminal Shape:

J BEND

Width:

2.79 mm

Trade Compliance

CWR29HC226KCGC Capacitors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8532.21.00.50

SB

8532.21.00.50

Manufacturer Highlights

KEMET Corporation

KEMET Corporation is an American electronics company that specializes in the design, manufacturing, and distribution of capacitors, electromagnetic compatibility solutions, and other electronic components. The company was founded in 1919 and is headquartered in Fort Lauderdale, Florida, with manufacturing facilities and sales offices around the world. KEMET Corporation and its subsidiaries (KEMET), is a wholly owned subsidiary of Yageo Corporation (TAIEX: 2327).

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Management team

CEO

William M. Lowe, Jr.

Executive VP & CFO

Gregory C. Thompson

Executive VP & President - TOKIN Corporation

Shigenori (Sean) Oyama

Manufacturer fab locations 25

Fab name Location Fab Initiation Wafer Capacity

Advanced Tantalum Manufacturing

Fabrication

Fab Initiation

-

USA

Simpsonville

Wafer Capacity

382

-

382

FELCO

Fabrication

Fab Initiation

-

USA

Chicago

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

USA

Fort Lauderdale

Wafer Capacity

61

-

61

-

Fabrication

Fab Initiation

-

Indonesia

Batam

Wafer Capacity

68

-

68

-

Fabrication

Fab Initiation

-

China

Anting-Shanghai

Wafer Capacity

73

-

73

-

Fabrication

Fab Initiation

-

Mexico

Matamoros

Wafer Capacity

286

-

286

-

Fabrication

Fab Initiation

-

Mexico

Ciudad Victoria

Wafer Capacity

265

-

265

Guadalupe

Fabrication

Fab Initiation

-

Mexico

Monterrey

Wafer Capacity

532

-

532

San Nicolas

Fabrication

Fab Initiation

-

Mexico

Monterrey

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

North Macedonia

Skopje

Wafer Capacity

126

-

126

Plant A

Fabrication

Fab Initiation

-

China

Suzhou

Wafer Capacity

353

-

353

Plant B

Fabrication

Fab Initiation

-

China

Suzhou

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

China

Xiamen

Wafer Capacity

432

-

432

-

Fabrication

Fab Initiation

-

Italy

Pontecchio

Wafer Capacity

226

-

226

-

Fabrication

Fab Initiation

-

Portugal

Evora

Wafer Capacity

233

-

233

TOKIN

Fabrication

Fab Initiation

-

Vietnam

Biên Hòa City

Wafer Capacity

174

-

174

TOKIN

Fabrication

Fab Initiation

-

Thailand

Hom Sin

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

Thailand

Chachoengsao

Wafer Capacity

171

-

171

TOKIN

Fabrication

Fab Initiation

-

Japan

Sendai

Wafer Capacity

378

-

378

TOKIN

Fabrication

Fab Initiation

-

Japan

Toyama

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

Japan

Nyuzen

Wafer Capacity

209

-

209

-

Fabrication

Fab Initiation

-

Japan

Shiroishi

Wafer Capacity

378

-

378

-

Fabrication

Fab Initiation

-

Finland

Suomussalmi

Wafer Capacity

56

-

56

-

Fabrication

Fab Initiation

-

Bulgaria

Kyustendil

Wafer Capacity

86

-

86

-

Fabrication

Fab Initiation

-

Sweden

Farjestaden

Wafer Capacity

28

-

28

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