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BC869-25

Jiangsu Changjiang Electronics Technology

BC869-25 by Jiangsu Changjiang Electronics Technology

PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 40 MHz; Maximum Power Dissipation (Abs): 1.35 W; Maximum Collector Current (IC): 2 A;

Median Price

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9

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R&J Components

USA . 26,000 parts In-Stock

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Vyrian

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Lantek

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ComSIT Distribution GmbH

Germany . 3,290 parts In-Stock

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Digiode

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Electronic Expediters

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Electronics Depot

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One Stop Electronics

USA . 1,575 parts In-Stock

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AZTECH Wire

Italy . 4,788 parts In-Stock

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Assy Fe

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Kepictronics

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Perfect Parts

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GreenTree Electronics

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Corphita

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Cyclops Electronics Ltd (Excess)

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Native Components

USA . 2,370 parts In-Stock

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Northwest PG Solutions

USA . 2,032 parts In-Stock

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A-Z Elektronik GmbH

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Supply Digital

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ChipstoGo Electronic ltd

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Technical Specifications

Other Function Transistors BC869-25 attributes and parameters. Explore more Other Function Transistors devices from Jiangsu Changjiang Electronics Technology

Specs

Maximum Collector Current (IC):

2 A

Configuration:

Minimum DC Current Gain (hFE):

160

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Nominal Transition Frequency (fT):

Trade Compliance

BC869-25 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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