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2SC4215Y

Jiangsu Changjiang Electronics Technology

2SC4215Y by Jiangsu Changjiang Electronics Technology

NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 260 MHz; Maximum Power Dissipation (Abs): .1 W; Maximum Collector Current (IC): .02 A;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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QIE Inc.

USA . 876 parts In-Stock

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876

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Huijzer Components

Netherlands . 73 parts In-Stock

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73

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Distributors (Availability)

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Kepictronics

USA . 9,320 parts In-Stock

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9,320

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Assy Fe

Spain . 1,762 parts In-Stock

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1,762

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Northwest PG Solutions

USA . 980 parts In-Stock

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980

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Native Components

USA . 843 parts In-Stock

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843

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Technical Specifications

Other Function Transistors 2SC4215Y attributes and parameters. Explore more Other Function Transistors devices from Jiangsu Changjiang Electronics Technology

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

100

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Nominal Transition Frequency (fT):

Trade Compliance

2SC4215Y Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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