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2SC2001L

Jiangsu Changjiang Electronics Technology

2SC2001L by Jiangsu Changjiang Electronics Technology

NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 50 MHz; Maximum Power Dissipation (Abs): .6 W; Maximum Collector Current (IC): .7 A;

Median Price

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Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Fibra_Brandt Electronic GMBH

Germany . 753 parts In-Stock

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753

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Distributors (Availability)

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Native Components

USA . 455 parts In-Stock

1+ parts

$1.624

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455

$1.624

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Northwest PG Solutions

USA . 438 parts In-Stock

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$1.786

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438

$1.786

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Component Stockers USA

USA . 262 parts In-Stock

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$99.990

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262

$99.990

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Kepictronics

USA . 56,000 parts In-Stock

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56,000

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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2,780

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Assy Fe

Spain . 9 parts In-Stock

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9

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Technical Specifications

Other Function Transistors 2SC2001L attributes and parameters. Explore more Other Function Transistors devices from Jiangsu Changjiang Electronics Technology

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

135

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

NO

Nominal Transition Frequency (fT):

Trade Compliance

2SC2001L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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