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ISL6146AFUZ-T7A

Intersil

ISL6146AFUZ-T7A by Intersil

BUFFER OR INVERTER BASED MOSFET DRIVER; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;

Median Price

$3.750

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

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DigiKey

USA . 100 parts In-Stock

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Renesas

USA . 31 parts In-Stock

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$3.850

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Flip Electronics

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Vyrian

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Nova Conductors

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Netsource Technology, Inc.

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Sensible Micro Corp

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Corohmni

South Africa . 588 parts In-Stock

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Ampacity Inc.

Singapore . 1,449 parts In-Stock

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Semicontronic

India . 1,137 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Microchip USA

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Argo Parts USA

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Supply Digital

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Perfect Parts

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Bastille Electronics

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Technical Specifications

MOSFET Gate Drivers ISL6146AFUZ-T7A attributes and parameters. Explore more MOSFET Gate Drivers devices from Intersil

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ISL6146AFUZ-T7A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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