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PEB3086H

Intel

PEB3086H by Intel

PCM TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 693 parts In-Stock

1+ parts

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693

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Digiode

USA . 660 parts In-Stock

1+ parts

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660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,834 parts In-Stock

1+ parts

$6.574

100+ parts

$6.311

1k+ parts

$6.048

10k+ parts

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1,834

$6.574

$6.311

$6.048

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MARBEL Systems

Belgium . 513 parts In-Stock

1+ parts

$12.827

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513

$12.827

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Texas Native Microelectronics

USA . 3,821 parts In-Stock

1+ parts

$14.744

100+ parts

$14.154

1k+ parts

$13.712

10k+ parts

$12.975

3,821

$14.744

$14.154

$13.712

$12.975

Kenton Components

USA . 58 parts In-Stock

1+ parts

$17.693

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-

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$15.570

58

$17.693

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$15.570

Qasali Group International

UK . 90 parts In-Stock

1+ parts

$39.809

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90

$39.809

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Andel Nordic

Denmark . 487 parts In-Stock

1+ parts

$58.660

100+ parts

-

1k+ parts

$41.061

10k+ parts

$41.061

487

$58.660

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$41.061

$41.061

Corphita

USA . 466 parts In-Stock

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466

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Technical Specifications

Digital Transmission Interfaces PEB3086H attributes and parameters. Explore more Digital Transmission Interfaces devices from Intel

Specs

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PEB3086H Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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