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EPXA4F672C1

Intel

EPXA4F672C1 by Intel

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

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Vyrian

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Prism Electronics

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Bristol Electronics

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Native Components

USA . 294 parts In-Stock

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$0.066

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Northwest PG Solutions

USA . 1,849 parts In-Stock

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Vigor

Singapore . 982 parts In-Stock

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Semicontronic

India . 127 parts In-Stock

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One Stop Electronics

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Modulus Dynamics

Lithuania . 862 parts In-Stock

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MARBEL Systems

Belgium . 9,164 parts In-Stock

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Kenton Components

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Component Stockers USA

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Texas Native Microelectronics

USA . 6,416 parts In-Stock

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Glotronic Ltd.

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Supply Digital

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Corphita

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Qasali Group International

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Corohmni

South Africa . 311 parts In-Stock

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Perfect Parts

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Speed Components Ltd (Excess)

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Technical Specifications

Programmable Logic Devices (PLD) EPXA4F672C1 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

Organization:

0 Dedicated Inputs, 426 I/O

Output Function:

Macrocell

No. of Dedicated Inputs:

0

No. of I/O Lines:

426

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

1.89 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Width:

27 mm

Length:

27 mm

Maximum Seated Height:

2.1 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

672

Terminal Pitch:

1 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EPXA4F672C1 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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