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EPM570F256C3

Intel

EPM570F256C3 by Intel

The Intel EPM570F256C3 is a FLASH PLD with 440 macro cells, 160 inputs/outputs, and 5.4 ns propagation delay. Ideal for applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.

Median Price

$123.550

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Arrow

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$123.550

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$108.970

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$97.390

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Verical

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$108.970

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Nova Conductors

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One Stop Electronics

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Netroflash

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Modulus Dynamics

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Perfect Parts

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Overview

Unlock the potential of your projects with the EPM570F256C3 by Intel. As a leading manufacturer in the industry, Intel delivers top-quality Programmable Logic Devices that offer unparalleled flexibility and reliability. Ideal for a wide range of applications, this PLD boasts 440 macro cells and 160 I/O lines, allowing you to customize your designs with ease. With fast propagation delay and in-system programmability, the EPM570F256C3 provides exceptional value and performance. Elevate your projects to new heights with Intel's innovative technology and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components, providing durability and protection for the PLD.

Propagation Delay: 5.4 ns

Low propagation delay ensures fast signal processing, making the PLD suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.625 V

The maximum supply voltage is within a safe range for the PLD, ensuring reliable operation without the risk of damage.

No. of Macro Cells: 440

Having a high number of macro cells allows for complex logic designs to be implemented in the PLD, providing versatility in application usage.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLD energy-efficient and reliable in noisy environments.

No. of Inputs: 160

With a high number of inputs, the PLD can accommodate a wide range of digital signals, enabling complex functions to be implemented.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for designs where size constraints are a consideration.

Form Of Terminal: BALL

Ball terminals offer reliable connections and easy soldering, ensuring secure attachment to the PCB.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage is the standard operating voltage for the PLD, ensuring compatibility with common power sources.

Power Supplies (V): 1.5/3.3,2.5/3.3

Multiple power supply options allow for flexibility in design and compatibility with different voltage requirements in the system.

No. of Terminals: 256

The high number of terminals provides ample connectivity options for interfacing with other components and peripherals.

Programmable IC Type: FLASH PLD

Flash programmability enables on-the-fly reconfiguration of the PLD, allowing for versatile and adaptive functionality in real-time applications.

Package Style (Meter): GRID ARRAY

Grid array packaging allows for high-density mounting on PCBs, optimizing space utilization and improving signal integrity.

In-System Programmable: YES

In-system programmability provides the flexibility to reconfigure the PLD without the need for physical access, enabling convenient updates and modifications.

Output Function: MACROCELL

Macrocell outputs offer configurable logic functions, allowing for customized signal processing and data manipulation within the PLD.

Minimum Supply Voltage: 2.375 V

The minimum supply voltage ensures reliable operation at low power levels, making the PLD suitable for energy-efficient designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the PLD to be used in a variety of environmental conditions without performance degradation.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch provides compatibility with standard PCB designs, making integration of the PLD straightforward and efficient.

Organization: 0 DEDICATED INPUTS, 160 I/O

Dedicated inputs and numerous I/O lines offer flexibility in signal routing and processing, enabling customized logic functions in the PLD.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures reliable performance even in cold environments, expanding the range of applications for the PLD.

Finishing Of Terminal Used: TIN LEAD

Tin lead finishing on terminals provides corrosion resistance and reliable solder joints, ensuring long-term connectivity in the PLD.

Position Of Terminal: BOTTOM

Bottom terminal placement simplifies PCB layout and component assembly, making the PLD suitable for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates the robustness of the PLD against humidity, ensuring long-term reliability in humid environments.

Maximum Seated Height: 2.2 mm

The low maximum seated height allows for compact integration of the PLD in tight spaces, facilitating dense PCB layouts.

Width: 17 mm

The compact width makes the PLD suitable for designs with space constraints, enabling versatile integration in various electronic systems.

No. of Outputs: 160

With a high number of outputs, the PLD can drive multiple external devices or signals, expanding its potential applications and functionality.

Length: 17 mm

The compact length of the PLD facilitates space-efficient integration in electronic systems, ideal for designs with compact form factors.

JTAG Boundary Scan Test: YES

JTAG boundary scan test capability allows for efficient debugging and testing of the PLD during development, ensuring reliable operation and performance.

No. of I/O Lines: 160

A high number of I/O lines provide ample connectivity options for interfacing with external devices, sensors, or peripherals, enhancing the versatility of the PLD.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading indicates the PLD's ability to operate reliably in extended temperature ranges, making it suitable for a wide range of applications.

Technical Specifications

Programmable Logic Devices (PLD) EPM570F256C3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 160 I/O

No. of Outputs:

160

Output Function:

Macrocell

No. of Inputs:

160

No. of Macro Cells:

440

No. of Dedicated Inputs:

0

No. of I/O Lines:

160

Propagation Delay:

5.4 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

It can also operate at 3.3 V

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM570F256C3 Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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