Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP2A15F672C9 by Intel is a PLD with 16640 logic cells, 480 inputs/outputs, and 2.23 ns propagation delay. It uses CMOS technology and is suitable for applications requiring fast processing speeds and high I/O capabilities in electronic systems.
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PLASTIC/EPOXY material provides durability and protection to the internal components of the device, ensuring longevity and reliability.
Low propagation delay ensures fast signal processing and responsiveness, making it suitable for applications requiring quick data processing.
High number of logic cells allow for complex programmable logic configurations, making it versatile and capable of handling intricate logic functions.
Surface mount compatibility allows for easy integration onto circuit boards, saving space and simplifying the assembly process.
Low maximum supply voltage requirement helps in reducing power consumption and heat generation, contributing to energy efficiency.
CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the device efficient and reliable.
A high number of inputs provide flexibility in connecting multiple external devices and sensors, enabling a wide range of input signals to be processed.
Square package shape simplifies the design and layout of the circuit board, facilitating easier integration and saving space.
Ball terminals enable easy soldering and rework, ensuring a secure connection and making maintenance or upgrades convenient.
Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, enhancing reliability.
Dual power supply options offer versatility in operating voltage requirements, enabling compatibility with a variety of system configurations.
High number of terminals allow for sufficient connectivity options and signal routing, enabling complex circuit designs to be implemented.
Loadable PLD type offers flexibility in reprogramming logic functions and configurations, allowing for customization and adaptation to changing requirements.
Grid array package style facilitates easy mounting and soldering onto circuit boards, providing a reliable mechanical connection and efficient signal routing.
Macrocell output function offers configurable and programmable output options, enabling tailored logic output responses to meet specific application needs.
Low minimum supply voltage requirement allows for operation even in low power scenarios, ensuring compatibility with a wide range of power sources.
High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.
Compact terminal pitch allows for high-density mounting and efficient use of board space, enabling smaller and more compact electronic designs.
Organized structure with 492 I/O lines provides clear connectivity options and signal routing paths, simplifying system integration and troubleshooting.
Low minimum operating temperature tolerance ensures proper functionality even in cold environments, enhancing the device's reliability and versatility.
Tin lead finishing on terminals offers good solderability and corrosion resistance, ensuring a reliable and durable connection for long-term use.
Bottom terminal positioning simplifies PCB layout and assembly, providing easy access for soldering and rework processes, enhancing usability and maintenance.
Moisture sensitivity level 3 indicates moderate moisture resistance, suitable for standard operating environments, ensuring long-term reliability and performance.
Low maximum seated height profile enables compact and slim device design, allowing for easy integration into space-constrained applications or electronic systems.
Moderate width dimension provides a balance between compact form factor and sufficient space for terminal connections, offering versatility in mounting options.
High number of outputs enable multiple logic output signals to be generated, supporting complex system functions and enabling diverse application usage.
Moderate length dimension provides a compact form factor while offering sufficient space for terminal connections, ensuring easy integration into various electronic systems.
High number of I/O lines provide extensive input/output connectivity options, enabling versatile signal routing and system integration capabilities for diverse applications.
Programmable Logic Devices (PLD) EP2A15F672C9 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EP2A15F672C9 Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Rfe International
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Uniohm
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diotec Semiconductor Ag
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
ROHM
Infinex
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
Microsemi
2N2222A
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
Nexperia
EPM570M100I5N
Intel
The Intel EPM570M100I5N is a FLASH PLD with 440 macro cells, 76 I/O lines, and 8.7 ns propagation delay. It is used for programmable logic applications requiring fast processing speeds and high input/output capabilities. The device features in-system programmability and JTAG boundary scan testing for efficient development and debugging processes.
GAL16V8D-15LPNI
Lattice Semiconductor
GAL16V8D-15LPNI by Lattice Semiconductor is a 5.5V CMOS PLD with 15ns propagation delay, ideal for industrial applications. Featuring 18 inputs, 8 dedicated inputs, and 8 I/O lines, it offers a clock frequency of up to 45.5MHz in a rectangular package with through-hole terminals.
EPF10K50ETI144-2N
Altera
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM240T100C5
The Intel EPM240T100C5 is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5 ns propagation delay. Ideal for applications requiring in-system programmability, it features a CMOS technology and operates at temperatures up to 85°C. With JTAG boundary scan test capability, this device offers versatile functionality in a compact form factor.
EPM240T100I5N
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Output Function: MACROCELL;
EPM7128STC100-15
EPM7128STC100-15 by Intel is a 128 macrocell EE PLD with 84 I/O lines, in-system programmable with JTAG boundary scan test. It operates at a max clock frequency of 100 MHz and has a propagation delay of 15 ns. Ideal for applications requiring fast processing speeds and high I/O capabilities.
XC2C64A-7VQG44C
Xilinx
XC2C64A-7VQG44C by Xilinx is a programmable logic device (PLD) with 64 macro cells. It uses CMOS technology and has a max clock frequency of 200 MHz. This PLD is commonly used for in-system programmable applications requiring high-speed processing.
LC4128ZC-75TN100E
LC4128ZC-75TN100E by Lattice Semiconductor is a 128 macrocell EE PLD with 7.5 ns propagation delay, 74 inputs, and 64 I/O lines. Ideal for applications requiring in-system programmability, it features a max clock frequency of 111 MHz and operates b/w -40 to 130 °C.
XC95144XL-10TQ144I
XC95144XL-10TQ144I by Xilinx is a 3.3V CMOS PLD with 117 I/O lines, 144 macro cells, and 81.3 MHz clock frequency. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing capabilities in a low-profile package with Gull Wing terminals.
ATF22V10C-7SX
Microchip Technology
ATF22V10C-7SX by Microchip Tech is a PLD with 7.5ns propagation delay, 132 product terms, and 125MHz clock frequency. Ideal for PAL-type architecture applications requiring fast processing speed in commercial-grade environments.
EPM7128SQC100-15
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
ATF22V10CQZ-20SU-T
ATF22V10CQZ-20SU-T by Microchip Technology is a 5.5V CMOS PLD with 20ns propagation delay, ideal for industrial applications. Featuring 22 inputs and 10 I/O lines, it offers a clock frequency of up to 38.5MHz in a small outline package style.
XC9536XL-10VQ44I
The Xilinx XC9536XL-10VQ44I is a 36 macrocell FLASH PLD with 34 inputs/outputs, operating at up to 138.88 MHz clock frequency. It features a propagation delay of 10 ns and can be in-system programmable, suitable for industrial applications requiring high-speed logic processing.
EPM570ZM100C6N
The Intel EPM570ZM100C6N is a FLASH PLD with 440 macro cells, 76 I/O lines, and 9.5 ns propagation delay. It uses CMOS technology and has a max supply voltage of 1.89 V. Ideal for applications requiring programmable logic devices with fast response times and high input/output capabilities in compact form factors.
XCR3128XL-10VQG100C
Xilinx XCR3128XL-10VQG100C is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has a propagation delay of 10 ns and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments.
LC4032V-5TN48C
LC4032V-5TN48C by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 outputs. Featuring a propagation delay of 5 ns, it operates at a max clock frequency of 156 MHz. Ideal for applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
EPM1270T144C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
ATF22V10CQ-15JU
Microchip's ATF22V10CQ-15JU is a 5.5V CMOS PLD with 15ns propagation delay, featuring 22 inputs and 10 I/O lines. Ideal for industrial applications, it offers a max clock frequency of 55.5MHz and supports up to 132 product terms in a square chip carrier package.
ATF1502AS-10JU44
Microchip Technology's ATF1502AS-10JU44 is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. With a propagation delay of 10 ns and max clock frequency of 83.33 MHz, it is ideal for PAL-type applications requiring fast processing speeds in programmable logic devices. The device is surface mountable, has JTAG boundary scan test capability, and operates b/w -40 to 85°C temperatures.
XC9572XL-5TQ100C
Xilinx XC9572XL-5TQ100C is a 3.3V FLASH PLD with 72 I/O lines, 5ns propagation delay, and 178.6MHz clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and communication systems.
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EP2A40F1020C9N
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;
EP2A15F672I8
LOADABLE PLD; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;
EP2A40B724C9N
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;
EP2A70B724C7N
EP2A70F1508C8
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1508; Package Code: BGA; Package Shape: SQUARE;
EP2A25F672C9N
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
EP2A40F672C9
EP2A15B724C7
EP2A25F672C7N
EP2A15F672C7
EP2A25F672I8
LOADABLE PLD; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN LEAD;
EP2A40B724C7N
EP2A70F1508C9
EP2A40F672C7N
EP2A40B724C8N
EP2A15F672I8N
LOADABLE PLD; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;
EP2A25B724C9
EP2A25B724C8
EP2A25F672C8N
EP2A15F672C8N
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