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EP2A15F672C9

Intel

EP2A15F672C9 by Intel

EP2A15F672C9 by Intel is a PLD with 16640 logic cells, 480 inputs/outputs, and 2.23 ns propagation delay. It uses CMOS technology and is suitable for applications requiring fast processing speeds and high I/O capabilities in electronic systems.

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Overview

Unlock a world of possibilities with the EP2A15F672C9 by Intel. Crafted with precision and expertise, this Programmable Logic Device offers unparalleled quality and performance. Ideal for a wide range of applications, from consumer electronics to industrial automation, this PLD boasts 16640 logic cells and 480 inputs, delivering lightning-fast propagation delay of just 2.23 ns. With a maximum supply voltage of 1.575 V and a grid array package style, this versatile device is designed to meet your every need. Experience the value and benefits that Intel brings to the table with the EP2A15F672C9 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the device, ensuring longevity and reliability.

Propagation Delay: 2.23 ns

Low propagation delay ensures fast signal processing and responsiveness, making it suitable for applications requiring quick data processing.

No. of Logic Cells: 16640

High number of logic cells allow for complex programmable logic configurations, making it versatile and capable of handling intricate logic functions.

Surface Mount: YES

Surface mount compatibility allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.575 V

Low maximum supply voltage requirement helps in reducing power consumption and heat generation, contributing to energy efficiency.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the device efficient and reliable.

No. of Inputs: 480

A high number of inputs provide flexibility in connecting multiple external devices and sensors, enabling a wide range of input signals to be processed.

Package Shape: SQUARE

Square package shape simplifies the design and layout of the circuit board, facilitating easier integration and saving space.

Form Of Terminal: BALL

Ball terminals enable easy soldering and rework, ensuring a secure connection and making maintenance or upgrades convenient.

Nominal Supply Voltage (V): 1.5

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, enhancing reliability.

Power Supplies (V): 1.5,1.5/3.3

Dual power supply options offer versatility in operating voltage requirements, enabling compatibility with a variety of system configurations.

No. of Terminals: 672

High number of terminals allow for sufficient connectivity options and signal routing, enabling complex circuit designs to be implemented.

Programmable IC Type: LOADABLE PLD

Loadable PLD type offers flexibility in reprogramming logic functions and configurations, allowing for customization and adaptation to changing requirements.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy mounting and soldering onto circuit boards, providing a reliable mechanical connection and efficient signal routing.

Output Function: MACROCELL

Macrocell output function offers configurable and programmable output options, enabling tailored logic output responses to meet specific application needs.

Minimum Supply Voltage: 1.425 V

Low minimum supply voltage requirement allows for operation even in low power scenarios, ensuring compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Pitch Of Terminal: 1 mm

Compact terminal pitch allows for high-density mounting and efficient use of board space, enabling smaller and more compact electronic designs.

Organization: 492 I/O

Organized structure with 492 I/O lines provides clear connectivity options and signal routing paths, simplifying system integration and troubleshooting.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance ensures proper functionality even in cold environments, enhancing the device's reliability and versatility.

Finishing Of Terminal Used: TIN LEAD

Tin lead finishing on terminals offers good solderability and corrosion resistance, ensuring a reliable and durable connection for long-term use.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, providing easy access for soldering and rework processes, enhancing usability and maintenance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate moisture resistance, suitable for standard operating environments, ensuring long-term reliability and performance.

Maximum Seated Height: 2.1 mm

Low maximum seated height profile enables compact and slim device design, allowing for easy integration into space-constrained applications or electronic systems.

Width: 27 mm

Moderate width dimension provides a balance between compact form factor and sufficient space for terminal connections, offering versatility in mounting options.

No. of Outputs: 480

High number of outputs enable multiple logic output signals to be generated, supporting complex system functions and enabling diverse application usage.

Length: 27 mm

Moderate length dimension provides a compact form factor while offering sufficient space for terminal connections, ensuring easy integration into various electronic systems.

No. of I/O Lines: 492

High number of I/O lines provide extensive input/output connectivity options, enabling versatile signal routing and system integration capabilities for diverse applications.

Technical Specifications

Programmable Logic Devices (PLD) EP2A15F672C9 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

Organization:

492 I/O

No. of Outputs:

480

Output Function:

Macrocell

No. of Inputs:

480

No. of Logic Cells:

16640

No. of I/O Lines:

492

Propagation Delay:

2.23 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies (V):

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA672,26X26,40

Width:

27 mm

Length:

27 mm

Maximum Seated Height:

2.1 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

672

Terminal Pitch:

1 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP2A15F672C9 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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