Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP1K50FC256-2 by Intel is a PLD with 2880 logic cells, 0.4 ns propagation delay, and 186 inputs/outputs. It operates at a max clock frequency of 37.5 MHz and is suitable for applications requiring high-speed processing in commercial temperature environments.
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PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable applications.
Low propagation delay enables fast signal processing and reduces latency in the system.
Large number of logic cells provide flexibility in designing complex digital circuits.
Surface mount technology makes the device easy to mount on PCBs, saving space and cost.
Operating at a low maximum supply voltage helps in reducing power consumption.
CMOS technology offers low power consumption and high noise immunity, making the device efficient and reliable.
High number of inputs allow for extensive interfacing and input signals in the design.
Square package shape provides uniformity and ease of mounting in compact spaces.
Ball terminals ensure secure connections and reliability in the device's operation.
Stable nominal supply voltage of 2.5V ensures consistent performance and compatibility with various systems.
Multiple power supply options allow for versatile compatibility and flexibility in different applications.
Higher number of terminals enable more connectivity and versatility in circuit design.
Loadable PLD type offers reprogrammability and flexibility in implementing changes or updates in the design.
Grid array package style provides high density integration and efficient use of PCB real estate.
Mixed output function allows for diverse output types, enhancing the device's capabilities and versatility.
Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.
High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions.
Narrow pitch of terminals enables compact design and high-density mounting on PCBs.
Organized layout of 186 I/Os simplifies system integration and connectivity in the design.
Low minimum operating temperature allows the device to function in various temperature environments.
Tin lead finishing ensures good solderability and reliability in terminal connections.
Bottom terminal positioning facilitates easier PCB mounting and connections in the system.
MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during assembly.
Low maximum seated height enables space-saving and compact design layouts.
Narrow width makes the device suitable for applications where space is limited.
High maximum clock frequency allows for fast signal processing and operation in time-critical applications.
Equal number of outputs as inputs ensures balanced interfacing capabilities and functionality.
Compact length facilitates efficient PCB layout and space utilization in electronic designs.
High number of I/O lines offer extensive connectivity options and versatility in system integration.
Commercial temperature grading ensures reliable performance in standard operating temperature ranges.
Programmable Logic Devices (PLD) EP1K50FC256-2 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EP1K50FC256-2 Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
1N4148
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
ATF16V8BQL-15XU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
ATF22V10CQZ-20SC
ATF22V10CQZ-20SC by Microchip is a 24-terminal PLD with 20ns propagation delay, operating at 5.25V max supply voltage. It features CMOS technology, FLASH PLD type, and supports up to 38.5MHz clock frequency. Ideal for applications requiring fast processing speeds in commercial temperature environments.
EPM570F256C5N
Altera
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCR3032XL-7CS48I
Xilinx
Xilinx XCR3032XL-7CS48I is a 32-macrocell EE PLD with 7.5ns propagation delay and 119MHz max clock frequency. Ideal for industrial applications, it features in-system programmability, 36 I/O lines, and JTAG boundary scan test capability.
LC4256V-5TN100I
Lattice Semiconductor
LC4256V-5TN100I by Lattice Semiconductor is a 3.3V EE PLD with 256 macro cells, 74 inputs, and 64 I/O lines. With a propagation delay of 5ns and max clock frequency of 156MHz, it's ideal for applications requiring fast processing speeds in programmable logic devices. The device is surface mountable and features JTAG boundary scan test capability for efficient testing processes.
ATF1502AS-7AX44
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XC9536XL-10VQG44I
Xilinx XC9536XL-10VQG44I is a 36 macrocell FLASH PLD with 34 I/O lines, operating at max 138.88 MHz clock frequency. It features 10 ns propagation delay and supports in-system programmability. Ideal for industrial applications requiring high-speed logic processing within temperature range of -40 to 85°C.
XA2C64A-8VQG44Q
XA2C64A-8VQG44Q by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, suitable for automotive applications. Operating at -40 to 125 °C, it features in-system programmability and JTAG boundary scan test capability. With a compact form factor of 10x10 mm and low power supplies of 1.5/3.3 V, it offers high performance in a small footprint for various electronic systems.
5M240ZT100I5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM240T100I3
The EPM240T100I3 by Altera is a programmable logic device with 192 macro cells. It has a propagation delay of 4.7 ns and uses CMOS technology. This surface mount device comes in a QFP package with 100 terminals and is in-system programmable. Its features include JTAG boundary scan test and a peak reflow temperature of 220°C.
EPF8452ALI84-4N
Intel
EPF8452ALI84-4N by Intel is a 5.5V CMOS PLD with 64 I/O lines, ideal for industrial applications. Featuring 4 dedicated inputs and registered output function, it operates b/w -40 to 85 °C. This square chip carrier has J bend terminals and matte tin finish, making it suitable for various programmable logic tasks.
EPM3064ATC100-10N
The Altera EPM3064ATC100-10N is a programmable logic device with a maximum clock frequency of 100 MHz and 66 I/O lines. It has a propagation delay of 10 ns and operates on a nominal supply voltage of 3.3 V. This PLD is commonly used for applications requiring in-system programmability and macrocell output functions.
EPF10K50ETI144-2N
EPF10K50ETI144-2N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 102 inputs/outputs. It operates at temperatures ranging from -40 to 85 °C and has a max supply voltage of 2.7 V. Ideal for industrial applications requiring fast processing and high I/O capacity in a compact form factor.
5M1270ZF256I5N
Intel's 5M1270ZF256I5N is a PLD with 980 macro cells, 211 I/O lines, and max clock freq of 201.1 MHz. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan test capability. Features include propagation delay of 10 ns, operating temp range -40 to +100°C, and package style grid array with low profile design.
LC4256ZE-7TN144I
LC4256ZE-7TN144I by Lattice Semiconductor is a 256 macrocell EE PLD with 96 I/O lines, 7.5 ns propagation delay, and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in compact designs.
ATF750CL-15JU
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
ATF1504ASL-25AU44
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XC95288XL-10FGG256C
The Xilinx XC95288XL-10FGG256C is a 288 macrocell FLASH PLD with 192 inputs/outputs, operating at up to 100 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and flexibility in programmable logic design.
ATF1504ASVL-20AU100
ATF1504ASVL-20AU100 by Microchip Technology is a 3.3V EE PLD with 64 I/O lines, 20ns propagation delay, and 83.3MHz clock frequency. Ideal for industrial applications requiring fast processing and high I/O capability in a compact square package with gull wing terminals.
XC95144XL-10TQG144I
XC95144XL-10TQG144I by Xilinx is a PLD with 117 I/O lines, 144 macro cells, and 138.88 MHz clock frequency. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing capabilities. With a compact form factor of 20x20 mm and low profile design, it operates b/w -40 to 85°C temperatures.
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EP1K50TC144-2N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP1K50TC144-2N by Intel is a PLD with 2880 logic cells, 0.4 ns propagation delay, and 102 inputs. It operates at 2.5V, has a clock frequency of 37.5 MHz, and is suitable for applications requiring high-speed processing in commercial temperature environments.
EP1K50QC208-1N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP1K50QC208-1N by Intel is a programmable logic device (PLD) with 2880 logic cells and a propagation delay of 0.3 ns. It is used for various applications requiring high-speed processing, such as telecommunications and industrial automation.
EP1K50QC208-3N
EP1K50QC208-3N by Intel is a PLD with 2880 logic cells, 0.5 ns propagation delay, and 147 inputs/outputs. It uses CMOS technology and operates at temperatures b/w 0 to 70 °C. Ideal for applications requiring fast processing speeds and high input/output capabilities in commercial-grade environments.
EP1K50TI144-2N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP1K50TI144-2N by Intel is a PLD with 2880 logic cells, 0.4 ns propagation delay, and 102 inputs/outputs. It operates on CMOS technology at a max clock frequency of 37.5 MHz. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact form factor.
EP1K30TC144-2N
EP1K50QC208-3
EP1K50TC144-3N
EP1K50TC144-3N by Intel is a PLD with 2880 logic cells, 0.5 ns propagation delay, and 102 inputs. It uses CMOS technology and operates at a max supply voltage of 2.625 V. Ideal for applications requiring fast processing speeds and high input/output capabilities in commercial temperature environments.
EP1K30TI144-2N
EP1K30TI144-2N by Intel is a PLD with 1728 logic cells, 0.4 ns propagation delay, and 102 inputs/outputs. It uses CMOS technology and operates at a max clock frequency of 37.5 MHz. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact form factor.
EP1K30FC256-1N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EP1K10TC144-3N
The EP1K10TC144-3N by Altera is a programmable logic device with 576 logic cells and a propagation delay of 0.7 ns. It has a maximum supply voltage of 2.625 V and uses CMOS technology. This PLD has 92 inputs and outputs, and is surface mountable. Its package style is flatpack with low profile and fine pitch. The EP1K10TC144-3N is suitable for various applications requiring mixed output function and commercial temperature grading.
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