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DYMD1724T11VCB

Intel

DYMD1724T11VCB by Intel

Intel's DYMD1724T11VCB is a 44-LQFP IC suitable for surface mounting. It features an interface for modems and has a Moisture Sensitivity Level of 3 (168 Hours). Ideal for applications requiring integrated circuits in the telecommunications industry.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

DYMD1724T11VCB by Intel
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DigiKey

USA . 21 parts In-Stock

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$1.250

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Digiode

USA . 484 parts In-Stock

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$1.112

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Vyrian

USA . 2,355 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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Prism Electronics

USA . 75 parts In-Stock

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Ampacity Inc.

Singapore . 22 parts In-Stock

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$0.990

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Corphita

USA . 369 parts In-Stock

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$1.053

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Microchip USA

USA . 130 parts In-Stock

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Argo Parts USA

USA . 3,921 parts In-Stock

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Texas Native Microelectronics

USA . 3,328 parts In-Stock

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Qasali Group International

UK . 3,328 parts In-Stock

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MARBEL Systems

Belgium . 3,098 parts In-Stock

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Continental Prestige Electronics

USA . 2,864 parts In-Stock

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Aranea Global

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Kenton Components

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Overview

Enhance your electronic devices with the high-quality DYMD1724T11VCB by Intel. As a leading manufacturer in the industry, Intel delivers top-notch integrated circuits that guarantee optimal performance and reliability. Whether you're looking to upgrade your modems or interface components, this product is the perfect solution. With its innovative design and advanced technology, the DYMD1724T11VCB offers exceptional value, efficiency, and seamless integration, making it a must-have for all your electronic needs. Experience the Intel difference and take your devices to the next level today!

Feature Benefit Bullets

Other Names: 830851

This unique identifier helps in easily identifying and ordering the correct product.

Category: Integrated Circuits (ICs)

Being an integrated circuit ensures that the product is compact and has multiple functions within a single chip.

Interface: Modems - ICs and Modules

The modem interface allows for communication with other devices and networks, making it versatile and compatible with a wide range of applications.

Package: Tray

The tray packaging keeps the product organized and protected during shipping and storage.

Mounting Type: Surface Mount

Surface mounting makes installation easier and saves space on the circuit board.

Package / Case: 44-LQFP

The 44-LQFP package provides a good balance of size and functionality, suitable for a variety of applications.

Supplier Device Package: 44-LQFP (10x10)

The supplier-specified packaging ensures compatibility and ease of use with other components in the system.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

With a moderate moisture sensitivity level, this product can withstand some environmental conditions without compromising performance.

Technical Specifications

Additional Parts DYMD1724T11VCB attributes and parameters. Explore more Additional Parts devices from Intel

Technical Specifications

Other Names:

830851

Category:

Integrated Circuits (ICs)
Interface Modems - ICs and Modules

Package / Case:

44-LQFP

Package:

Tray

Mounting Type:

Surface Mount

Supplier Device Package:

44-LQFP (10x10)

Standard Package:

1

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

DYMD1724T11VCB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991B1

HTS

8542.39.0001

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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