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XC2768X136F128LRAAKXUMA1

Infineon Technologies

XC2768X136F128LRAAKXUMA1 by Infineon Technologies

Infineon's XC2768X136F128LRAAKXUMA1 is a 32-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 16-channel ADC, 16-channel PWM, and various connectivity options like CAN, I2C, SPI, and UART. With a temperature range of -40 to 125 °C, this CMOS technology-based MCU offers 92160 bytes of RAM and flash ROM programmability.

Median Price

$24.465

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 84 parts In-Stock

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$24.465

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Vyrian

USA . 5,983 parts In-Stock

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Digiode

USA . 788 parts In-Stock

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788

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Distributors (Availability)

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AZTECH Wire

Italy . 354 parts In-Stock

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$5.912

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354

$5.912

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Semicontronic

India . 427 parts In-Stock

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$15.000

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$14.625

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$14.550

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427

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$14.550

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Modulus Dynamics

Lithuania . 4,751 parts In-Stock

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$21.273

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$20.422

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$19.571

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4,751

$21.273

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Corohmni

South Africa . 51 parts In-Stock

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$21.273

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51

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Ampacity Inc.

Singapore . 659 parts In-Stock

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$22.000

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659

$22.000

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Aztec Data Supply Inc.

USA . 2,389 parts In-Stock

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$23.640

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2,389

$23.640

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Continental Prestige Electronics

USA . 315 parts In-Stock

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$24.465

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$23.975

315

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$23.975

Microchip USA

USA . 1,831 parts In-Stock

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$53.278

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Netroflash

USA . 2,000 parts In-Stock

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$23.975

1k+ parts

$23.241

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$22.752

2,000

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$23.975

$23.241

$22.752

Argo Parts USA

USA . 1,740 parts In-Stock

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Corphita

USA . 775 parts In-Stock

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Overview

Unleash the power of innovation with the XC2768X136F128LRAAKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality microcontrollers that set new standards for performance and reliability. Ideal for automotive applications, this microcontroller offers a wide range of features including PWM channels, ADC channels, and connectivity options like CAN, I2C, SPI, and UART. Experience seamless operation and enhanced functionality with the XC2768X136F128LRAAKXUMA1, where excellence meets value for our customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microcontroller onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the microcontroller can handle a wide range of power inputs, offering flexibility in application design.

Address Bus Width: 24

A wide address bus width of 24 bits allows for efficient memory addressing and data retrieval, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and allowing for more efficient layout of components.

Bit Size: 32

A 32-bit architecture provides enhanced processing speed and capability, making the microcontroller suitable for complex tasks and applications.

No. of Terminals: 100

Having a high number of terminals enables the microcontroller to interface with a wide range of external components and peripherals, expanding its functionality.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for power-efficient operation, making the microcontroller suitable for battery-powered devices or applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments and industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to operate in cold environments without sacrificing performance or functionality.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple high-quality terminal finishes ensures a reliable connection between the microcontroller and external components, reducing the risk of signal loss or corrosion.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, expanding its compatibility with various sensors and input devices.

Terminal Position: QUAD

Quad terminal position offers stable and secure mounting on the PCB, enhancing reliability and reducing the risk of connection issues during operation.

ROM Words: 1114112

With a large ROM capacity of 1114112 words, the microcontroller can store a significant amount of program data and instructions, making it suitable for complex applications.

Width: 14 mm

The compact width of 14mm allows for space-efficient integration of the microcontroller into electronic devices and systems.

External Data Bus Width: 16

A wide external data bus width of 16 bits enables fast data transfer between the microcontroller and external peripherals, enhancing overall performance.

Peripherals: POR, RTC, TIMER(6), WDT

The inclusion of various peripherals such as Power-On-Reset, Real-Time Clock, Timers, and Watchdog Timer enhances the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz allows for fast processing speeds, making the microcontroller suitable for real-time applications and tasks that require quick response times.

Length: 14 mm

The compact length of 14mm complements the width and package shape of the microcontroller, enabling a space-efficient design for electronic systems and devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the microcontroller meets the specific temperature and performance requirements of the automotive industry, ensuring reliability and durability.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals, it offers a cost-effective and space-saving solution for embedded systems and IoT applications.

RAM Bytes: 92160

With a generous RAM capacity of 92160 bytes, the microcontroller can efficiently handle data processing and storage requirements, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various environmental conditions.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure soldering connections on the PCB, reducing the risk of solder joints breaking or becoming detached during operation.

Analog To Digital Convertors: 16-Ch 10-Bit

With 16 channels and 10-bit resolution, the analog-to-digital converters enable precise and accurate conversion of analog signals, making the microcontroller suitable for sensor interfacing and data acquisition.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures compatibility with standard power sources and allows for easy integration into existing electronic systems without the need for additional power conversion.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate pulse-width modulated signals, which is useful for controlling motors, LEDs, and other devices that require variable power output.

Connectivity: CAN(2), I2C, I2S, LIN, SPI(6), UART

Support for multiple communication interfaces such as CAN, I2C, I2S, LIN, SPI, and UART allows the microcontroller to communicate with a wide range of external devices and sensors, enhancing connectivity and interoperability in diverse applications.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and efficient reprogramming of the microcontroller's memory, enabling firmware updates and customization without the need for specialized equipment or processes.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, reducing PCB space requirements and allowing for more compact designs in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microcontroller can withstand moderate exposure to moisture during storage or assembly processes, ensuring reliability and performance in humid or damp environments.

Speed: 128 rpm

The operating speed of 128 rpm ensures efficient processing of instructions and data, making the microcontroller suitable for applications that require rapid response times and high-speed operation.

On Chip Program ROM Width: 8

The on-chip programmable ROM width of 8 bits allows for efficient storage and retrieval of program instructions, enhancing the overall performance and versatility of the microcontroller.

No. of I/O Lines: 75

Having 75 I/O lines provides ample connectivity options for interfacing with external components and peripherals, allowing for versatile functionality and customization in system design.

Technical Specifications

Microcontrollers XC2768X136F128LRAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

75

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

92160

ROM Words:

1114112

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

128 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, I2S, LIN, SPI(6), UART

Peripherals:

POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

XC2768X136F128LRAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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