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V23079-A2008-B301

Infineon Technologies

V23079-A2008-B301 by Infineon Technologies

RF RELAY; Mounting Feature: PANEL MOUNT; Relay Action: MOMENTARY; Relay Function: DPDT; Coil or Input Supply Type: DC; Reference Standard: CSA; UL;

Median Price

$2.730

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 4 parts In-Stock

1+ parts

$0.650

100+ parts

$0.650

1k+ parts

$0.650

10k+ parts

$0.650

4

$0.650

$0.650

$0.650

$0.650

Farnell

UK . 1,393 parts In-Stock

1+ parts

$2.430

100+ parts

$1.600

1k+ parts

$1.420

10k+ parts

$1.270

1,393

$2.430

$1.600

$1.420

$1.270

Element14

Singapore . 2,000 parts In-Stock

1+ parts

$4.920

100+ parts

$3.600

1k+ parts

-

10k+ parts

-

2,000

$4.920

$3.600

-

-

Mouser Electronics

USA . 1,687 parts In-Stock

1+ parts

$5.100

100+ parts

$3.060

1k+ parts

$2.640

10k+ parts

$2.320

1,687

$5.100

$3.060

$2.640

$2.320

Master Electronics

USA . 10 parts In-Stock

1+ parts

$6.336

100+ parts

$5.680

1k+ parts

$2.920

10k+ parts

$2.010

10

$6.336

$5.680

$2.920

$2.010

Verical

USA . 1,106 parts In-Stock

1+ parts

-

100+ parts

$2.031

1k+ parts

$1.869

10k+ parts

-

1,106

-

$2.031

$1.869

-

PEI Genesis

USA . 510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

510

-

-

-

-

Chip1Stop

Japan . 110 parts In-Stock

1+ parts

-

100+ parts

$2.730

1k+ parts

-

10k+ parts

-

110

-

$2.730

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 900 parts In-Stock

1+ parts

$2.031

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$2.031

-

-

-

Digiode

USA . 22 parts In-Stock

1+ parts

$2.308

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$2.308

-

-

-

Ack Elektronik San.Tic.Ltd.Sti

. 1,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

-

-

-

-

Rapid Electronics

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

IBS Electronics

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.392

10k+ parts

-

110

-

-

$2.392

-

Cyclops Electronics Ltd

UK . 41 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

41

-

-

-

-

LWI Electronics Inc

India . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 823 parts In-Stock

1+ parts

$1.361

100+ parts

$1.307

1k+ parts

$1.252

10k+ parts

-

823

$1.361

$1.307

$1.252

-

Corphita

USA . 755 parts In-Stock

1+ parts

$2.187

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$2.187

-

-

-

Continental Prestige Electronics

USA . 1,121 parts In-Stock

1+ parts

$3.410

100+ parts

$2.550

1k+ parts

-

10k+ parts

-

1,121

$3.410

$2.550

-

-

Aztec Data Supply Inc.

USA . 200 parts In-Stock

1+ parts

$4.086

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$4.086

-

-

-

Kepictronics

USA . 71,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

71,929

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Assy Fe

Spain . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,300

-

-

-

-

Technical Specifications

Radio Frequency Relays V23079-A2008-B301 attributes and parameters. Explore more Radio Frequency Relays devices from Infineon Technologies

Relay Specifications

Relay Type:

Relay Function:

Relay Action:

Relay Form:

2 Form C

Physical Characteristics

Height:

0.374 in (9.5 mm)

Length/Diameter:

0.575 in (14.6 mm)

Dimensions:

0.591 x 0.295 x 0.374 in (15 x 7.5 x 9.5 mm)

Width:

7.2 in (182.88 mm)

Weight:

2.8 g

Mounting Type:

Packing Method:

Box

Operational Characteristics

Activation Time:

8 ms

Release Time:

9 ms

Insulation Resistance:

1 GΩ

Maximum Insertion Loss:

-0.27 dB

Minimum Operating Frequency:

100 MHz

Maximum Operating Frequency:

900 MHz

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Transition Time:

17 ms

Maximum Isolation:

-20.7 dB

Voltage Standing Wave Ratio:

1.4

Coil-Contacts Dielectric Strength:

1.5 kVrms

Coil Electrical Specifications

Coil Maximum AC Voltage:

48 V

Coil Resistance:

64 Ω

Coil Maximum DC Voltage:

3 V

Coil Power:

140 mW

Coil Maximum DC Current:

47 mA

Coil DC Operate Voltage:

2.25 V

Coil DC Release Voltage:

300 mV

Contact Electrical Specifications

Contact Maximum DC Current:

2 A

Contact Maximum DC Voltage:

220 V

Contact Maximum DC Rating (R Load):

2A@220VDC

Contact Maximum AC Current:

2 A

Contact Maximum AC Voltage:

250 V

Contact Maximum AC Rating (R Load):

2A@250VAC

Open Contacts Dielectric Strength:

1 kVrms

Terminal & Contact Material

Termination Type:

Solder/Quick Connect

Contact End Material:

Nickel

Reliability & Standards

Industry Standard Compliance:

Lifespan:

200000 Cycle(s)

Sealing Type:

IP67

Trade Compliance

V23079-A2008-B301 Relays trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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