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TLE8457CSJXUMA1

Infineon Technologies

TLE8457CSJXUMA1 by Infineon Technologies

LINE TRANSCEIVER; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): NOT SPECIFIED; JESD-609 Code: e3; Terminal Finish: Tin (Sn);

Median Price

$1.315

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,480 parts In-Stock

1+ parts

$1.260

100+ parts

$1.060

1k+ parts

$1.010

10k+ parts

$0.935

2,480

$1.260

$1.060

$1.010

$0.935

Chip1Stop

Japan . 2,473 parts In-Stock

1+ parts

$1.310

100+ parts

$0.760

1k+ parts

$0.662

10k+ parts

$0.635

2,473

$1.310

$0.760

$0.662

$0.635

Mouser Electronics

USA . 11,285 parts In-Stock

1+ parts

$1.320

100+ parts

$0.769

1k+ parts

$0.670

10k+ parts

$0.612

11,285

$1.320

$0.769

$0.670

$0.612

DigiKey

USA . 2,356 parts In-Stock

1+ parts

$1.320

100+ parts

$0.769

1k+ parts

$0.670

10k+ parts

$0.622

2,356

$1.320

$0.769

$0.670

$0.622

Newark

USA . 694 parts In-Stock

1+ parts

$1.360

100+ parts

$0.795

1k+ parts

$0.692

10k+ parts

-

694

$1.360

$0.795

$0.692

-

Farnell

UK . 784 parts In-Stock

1+ parts

$1.746

100+ parts

$1.117

1k+ parts

$0.755

10k+ parts

$0.703

784

$1.746

$1.117

$0.755

$0.703

Verical

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

$0.866

1k+ parts

$0.686

10k+ parts

$0.638

2,473

-

$0.866

$0.686

$0.638

Element14

Singapore . 784 parts In-Stock

1+ parts

-

100+ parts

$1.180

1k+ parts

$0.789

10k+ parts

$0.715

784

-

$1.180

$0.789

$0.715

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.922

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.922

-

-

-

Digiode

USA . 447 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

447

$1.064

-

-

-

IBS Electronics

USA . 2,480 parts In-Stock

1+ parts

$1.753

100+ parts

$1.487

1k+ parts

-

10k+ parts

$0.722

2,480

$1.753

$1.487

-

$0.722

Cyclops Electronics Ltd

UK . 17,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,500

-

-

-

-

Vyrian

USA . 2,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,732

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,889 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

-

10k+ parts

-

2,889

$0.369

-

-

-

Argo Parts USA

USA . 508 parts In-Stock

1+ parts

$0.922

100+ parts

-

1k+ parts

-

10k+ parts

-

508

$0.922

-

-

-

Corphita

USA . 842 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

842

$1.008

-

-

-

Component Stockers USA

USA . 16,303 parts In-Stock

1+ parts

$1.450

100+ parts

$0.660

1k+ parts

$0.640

10k+ parts

$0.790

16,303

$1.450

$0.660

$0.640

$0.790

Microchip USA

USA . 3,862 parts In-Stock

1+ parts

$4.762

100+ parts

-

1k+ parts

-

10k+ parts

-

3,862

$4.762

-

-

-

Lixinc

USA . 2,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.904

1k+ parts

$0.876

10k+ parts

$0.858

2,000

-

$0.904

$0.876

$0.858

Continental Prestige Electronics

USA . 871 parts In-Stock

1+ parts

-

100+ parts

$0.945

1k+ parts

$0.645

10k+ parts

-

871

-

$0.945

$0.645

-

Technical Specifications

Line Drivers & Receivers TLE8457CSJXUMA1 attributes and parameters. Explore more Line Drivers & Receivers devices from Infineon Technologies

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

NOT SPECIFIED

Terminal Finish:

Tin (Sn)

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TLE8457CSJXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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