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TLE72592GEXUMA1

Infineon Technologies

TLE72592GEXUMA1 by Infineon Technologies

TLE72592GEXUMA1 by Infineon is a Line Transceiver with 8 terminals, BCDMOS technology, and Schmitt Trigger input. It operates in automotive applications with a supply voltage range of 7-27 V and temperature range of -40 to 125°C. The package is small outline, surface mountable, and has a max seated height of 1.75 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 3,700 parts In-Stock

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3,700

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ComSIT USA

USA . 3,700 parts In-Stock

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3,700

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Vyrian

USA . 2,248 parts In-Stock

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2,248

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Greenchips

USA . 278 parts In-Stock

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278

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Digiode

USA . 231 parts In-Stock

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231

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Nova Conductors

Japan . 35 parts In-Stock

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35

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Distributors (Availability)

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AZTECH Wire

Italy . 467 parts In-Stock

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$5.143

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467

$5.143

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Aztec Data Supply Inc.

USA . 557 parts In-Stock

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$10.130

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557

$10.130

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Corohmni

South Africa . 7 parts In-Stock

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$10.606

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7

$10.606

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Modulus Dynamics

Lithuania . 1,885 parts In-Stock

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$13.496

100+ parts

$12.956

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$12.416

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1,885

$13.496

$12.956

$12.416

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Ampacity Inc.

Singapore . 357 parts In-Stock

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$49.500

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357

$49.500

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RC Electronics

USA . 72,184 parts In-Stock

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$0.680

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$0.630

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$0.610

72,184

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$0.610

Continental Prestige Electronics

USA . 2,832 parts In-Stock

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Perfect Parts

USA . 1,353 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Corphita

USA . 331 parts In-Stock

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331

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Microchip USA

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Argo Parts USA

USA . 131 parts In-Stock

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Bastille Electronics

Australia . 61 parts In-Stock

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61

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Overview

Elevate your automotive electronic systems with the TLE72592GEXUMA1 by Infineon Technologies. Built with precision and quality in mind, this line driver & receiver offers unparalleled reliability and performance. Whether you're looking to enhance communication between components or improve signal transmission, this product is the perfect solution. With a wide operating temperature range and advanced technology, Infineon's TLE72592GEXUMA1 ensures seamless functionality in even the most demanding environments. Trust in the value and benefits that this top-notch component brings to your projects. Experience the difference with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing manual assembly time.

Maximum Supply Voltage: 27 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, ensuring reliable performance in different operating conditions.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, facilitating integration into existing electronic systems.

No. of Terminals: 8

Having 8 terminals provides ample connection options for interfacing with other components, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes the footprint of the product on the PCB, ideal for space-constrained applications.

Minimum Supply Voltage: 7 V

Low minimum supply voltage requirement allows for operation in systems with limited power availability, increasing versatility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environmental conditions or extended operation periods.

Minimum Operating Temperature: -40 °C

Wide temperature range enables this product to function in extreme cold environments, offering reliable performance in diverse applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term connectivity and signal integrity.

Terminal Position: DUAL

Dual terminal positioning enables easy connection to external components or circuits, simplifying the integration process.

Maximum Seated Height: 1.75 mm

Low seated height facilitates compact design layouts, enhancing space efficiency in electronic assemblies.

Width: 4 mm

Narrow width dimension saves valuable PCB real estate, allowing for more components to be placed on the board.

Length: 5 mm

Short length dimension contributes to a smaller overall product size, suitable for applications with limited space constraints.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable performance in automotive applications, where temperature fluctuations are common.

Maximum Receive Delay: 6000 ns

Low receive delay time enhances the responsiveness of the product, critical for real-time data transmission applications.

Technology: BCDMOS

BCDMOS technology combines the benefits of Bipolar-CMOS-DMOS for improved power efficiency and performance in signal processing applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process, enhancing manufacturing efficiency and ensuring reliable electrical connections.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide hysteresis for noise immunity and signal stabilization, enhancing the reliability of data transmission.

Nominal Supply Voltage: 13.5 V

Stable nominal supply voltage ensures consistent operation and compatibility with typical power sources, enhancing overall system performance.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting on PCBs, enabling compact and efficient circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, making this product suitable for a wide range of environmental conditions.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type facilitates bidirectional communication between devices, making it suitable for networking and data transmission applications.

Technical Specifications

Line Drivers & Receivers TLE72592GEXUMA1 attributes and parameters. Explore more Line Drivers & Receivers devices from Infineon Technologies

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

27 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE72592GEXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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