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TLE42403MHTSA1

Infineon Technologies

TLE42403MHTSA1 by Infineon Technologies

TLE42403MHTSA1 by Infineon Technologies is a small outline LED display driver with 5 terminals and serial data input mode. It operates b/w 3V to 45V, making it suitable for graphics display applications. With a compact size of 2.9mm x 1.6mm x 1.1mm, this surface-mount device is ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,310 parts In-Stock

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3,310

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Digiode

USA . 838 parts In-Stock

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838

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,787 parts In-Stock

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$3.100

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$3.100

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Modulus Dynamics

Lithuania . 1,613 parts In-Stock

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$4.258

100+ parts

$4.088

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$3.917

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1,613

$4.258

$4.088

$3.917

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Corohmni

South Africa . 620 parts In-Stock

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$9.413

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620

$9.413

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AZTECH Wire

Italy . 424 parts In-Stock

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$16.284

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424

$16.284

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Ampacity Inc.

Singapore . 812 parts In-Stock

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$49.500

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812

$49.500

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Continental Prestige Electronics

USA . 3,404 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,015 parts In-Stock

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Microchip USA

USA . 426 parts In-Stock

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426

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Corphita

USA . 381 parts In-Stock

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381

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Overview

Enhance your graphic displays with the TLE42403MHTSA1 by Infineon Technologies. Crafted with precision using high-quality materials, this LED display driver offers unrivaled performance and reliability. Perfect for a wide range of applications, this product is designed to provide seamless data input through its serial mode, making it easy to use for professionals and hobbyists alike. Elevate your projects with the superior value, benefits, and advantages that the TLE42403MHTSA1 brings to the table. Experience the difference in quality and efficiency with this innovative solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and durable, ideal for portable devices.

Data Input Mode: SERIAL

Serial data input mode allows for easy integration with other serial communication systems, enhancing compatibility.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 45 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with various voltage standards.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for easy integration into electronic circuits.

No. of Terminals: 5

Having 5 terminals provides enough connectivity options for driving LED displays efficiently.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style saves space on the PCB, making it suitable for compact designs.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in low-power scenarios, enhancing energy efficiency.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves reliability of connections in the device.

Maximum Seated Height: 1.1 mm

Low maximum seated height allows for slim device design and integration in thin form factors.

Width: 1.6 mm

Narrow width enables compact PCB layout and space-saving design.

Length: 2.9 mm

Short length facilitates space-efficient board design and easy integration into small enclosures.

Terminal Form: GULL WING

Gull wing terminal form ensures secure solder joints and reliable connections for long-term use.

Nominal Supply Voltage: 13.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

No. of Segments: 3

Having 3 segments allows for driving multi-segment LED displays, providing versatility in display options.

Terminal Pitch: 0.95 mm

Fine terminal pitch facilitates high-density mounting and compact layout, suitable for miniaturized designs.

Interface IC Type: LED DISPLAY DRIVER

Being an LED display driver, this product is designed specifically for driving LED displays, ensuring optimal performance.

Technical Specifications

Graphics Display Drivers TLE42403MHTSA1 attributes and parameters. Explore more Graphics Display Drivers devices from Infineon Technologies

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

TLE42403MHTSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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