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TC322LP16F160FAAKXUMA1

Infineon Technologies

TC322LP16F160FAAKXUMA1 by Infineon Technologies

Infineon's TC322LP16F160FAAKXUMA1 is a 32-bit microcontroller with 80 terminals, operating at up to 160 MHz. Ideal for automotive applications, it features ADC and DMA channels, Flash ROM programmability, and a max supply voltage of 3.63V.

Median Price

$17.510

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,973 parts In-Stock

1+ parts

$17.510

100+ parts

$12.001

1k+ parts

$11.961

10k+ parts

$10.843

1,973

$17.510

$12.001

$11.961

$10.843

EBV Elektronik

Germany . 252,000 parts In-Stock

1+ parts

-

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252,000

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Distributors (In-Stock)

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Digiode

USA . 334 parts In-Stock

1+ parts

$17.594

100+ parts

-

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334

$17.594

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TME

Poland . 231,900 parts In-Stock

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$13.870

231,900

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$13.870

NAC Semi

USA . 183,600 parts In-Stock

1+ parts

-

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$22.430

183,600

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$22.430

Vyrian

USA . 1,348 parts In-Stock

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1,348

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Nova Conductors

Japan . 26 parts In-Stock

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26

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Greenchips

USA . 15 parts In-Stock

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15

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,373 parts In-Stock

1+ parts

$15.740

100+ parts

-

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1,373

$15.740

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Corphita

USA . 670 parts In-Stock

1+ parts

$16.668

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670

$16.668

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Corohmni

South Africa . 997 parts In-Stock

1+ parts

$49.792

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997

$49.792

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Modulus Dynamics

Lithuania . 588 parts In-Stock

1+ parts

$71.264

100+ parts

$68.413

1k+ parts

$65.563

10k+ parts

-

588

$71.264

$68.413

$65.563

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Aztec Data Supply Inc.

USA . 4,553 parts In-Stock

1+ parts

$83.245

100+ parts

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4,553

$83.245

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Microchip USA

USA . 1,730 parts In-Stock

1+ parts

$103.195

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1,730

$103.195

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Continental Prestige Electronics

USA . 4,402 parts In-Stock

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4,402

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 797 parts In-Stock

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797

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Overview

Unlock the power of innovation with the TC322LP16F160FAAKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality microcontrollers that are essential for a wide range of applications. With cutting-edge technology and reliable performance, this microcontroller offers customers unparalleled value and benefits. Whether you're designing automotive systems, consumer electronics, or industrial equipment, the TC322LP16F160FAAKXUMA1 provides the flexibility and efficiency you need to bring your ideas to life. Trust in Infineon to deliver the ultimate solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures the product is sturdy and easy to handle.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and effort.

Maximum Supply Voltage: 3.63 V

Wide range of supply voltage allows flexibility in different power requirements.

Package Shape: SQUARE

Square shape provides efficient use of space and easy placement on the circuit board.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities.

No. of Terminals: 80

Sufficient number of terminals ensure connectivity to various components and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles allow for versatile usage in different applications and designs.

Minimum Supply Voltage: 2.97 V

Low minimum supply voltage ensures energy efficiency and reliable operation.

Maximum Operating Temperature: 125 °C

High operating temperature range enables reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature makes this product suitable for both extreme cold and high-temperature environments.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Multiple terminal finish options provide better connectivity and corrosion resistance.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate and precise data acquisition from analog sensors.

DMA Channels: YES

Direct memory access channels help in efficient data transfer and multitasking capabilities.

Terminal Position: QUAD

Quad terminal positioning aids in easy installation and better connectivity with other components.

Maximum Seated Height: 1.2 mm

Low seated height enables compact design and space-saving in the overall system architecture.

Width: 10 mm

Narrow width allows for compact board layout and space efficiency.

Maximum Clock Frequency: 160 MHz

High clock frequency provides fast processing and response times in computing tasks.

Length: 10 mm

Optimal length for space-efficient placement on the circuit board.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable performance in automotive applications with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type peripheral IC provides versatile and customizable interfacing capabilities with external devices.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation for efficient performance.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and strong mechanical connection on the PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent operation and compatibility with standard power sources.

PWM Channels: YES

Pulse-width modulation channels enable precise control over various output signals.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and flexible program storage options.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and compact PCB design.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates the level of moisture resistance, making this product suitable for a variety of environments.

Speed: 160 rpm

High speed of 160 rpm ensures fast data processing and response times in real-time applications.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width provides sufficient storage capacity for firmware and program code.

Technical Specifications

Microcontrollers TC322LP16F160FAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 5V NOM SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TC322LP16F160FAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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