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TC267D40F200NBCKXUMA1

Infineon Technologies

TC267D40F200NBCKXUMA1 by Infineon Technologies

Infineon's TC267D40F200NBCKXUMA1 microcontroller features 32-bit architecture, 200 MHz clock frequency, and 245760 bytes of RAM. Ideal for applications requiring CAN connectivity, with DMA and ADC channels for efficient data handling. Package style is grid array with a compact size of 17mm x 17mm, suitable for space-constrained designs.

Median Price

$33.701

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 39 parts In-Stock

1+ parts

$28.280

100+ parts

$19.953

1k+ parts

$18.453

10k+ parts

-

39

$28.280

$19.953

$18.453

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Element14

Singapore . 1,000 parts In-Stock

1+ parts

$34.800

100+ parts

$24.770

1k+ parts

-

10k+ parts

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1,000

$34.800

$24.770

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Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$33.701

10k+ parts

$32.048

1,000

-

-

$33.701

$32.048

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$24.018

100+ parts

-

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-

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700

$24.018

-

-

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Digiode

USA . 567 parts In-Stock

1+ parts

$31.768

100+ parts

-

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567

$31.768

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-

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Tomark Electronics Ltd

UK . 10 parts In-Stock

1+ parts

$141.540

100+ parts

-

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10

$141.540

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-

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Vyrian

USA . 3,243 parts In-Stock

1+ parts

-

100+ parts

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3,243

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 425 parts In-Stock

1+ parts

$24.018

100+ parts

-

1k+ parts

-

10k+ parts

$23.538

425

$24.018

-

-

$23.538

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$24.020

100+ parts

$22.819

1k+ parts

-

10k+ parts

$21.378

1,000

$24.020

$22.819

-

$21.378

Semicontronic

India . 1,110 parts In-Stock

1+ parts

$28.420

100+ parts

$27.710

1k+ parts

$27.567

10k+ parts

-

1,110

$28.420

$27.710

$27.567

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Ampacity Inc.

Singapore . 866 parts In-Stock

1+ parts

$28.420

100+ parts

-

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866

$28.420

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$28.753

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71

$28.753

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Aztec Data Supply Inc.

USA . 1,534 parts In-Stock

1+ parts

$28.818

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1,534

$28.818

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Corphita

USA . 884 parts In-Stock

1+ parts

$30.096

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884

$30.096

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Modulus Dynamics

Lithuania . 2,766 parts In-Stock

1+ parts

$46.625

100+ parts

$44.760

1k+ parts

$42.895

10k+ parts

-

2,766

$46.625

$44.760

$42.895

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Microchip USA

USA . 2,170 parts In-Stock

1+ parts

$47.370

100+ parts

$46.550

1k+ parts

$46.140

10k+ parts

$45.730

2,170

$47.370

$46.550

$46.140

$45.730

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$83.626

100+ parts

$79.444

1k+ parts

$79.444

10k+ parts

-

500

$83.626

$79.444

$79.444

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Argo Parts USA

USA . 4,779 parts In-Stock

1+ parts

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4,779

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of cutting-edge technology with the TC267D40F200NBCKXUMA1 microcontroller by Infineon Technologies. Renowned for their top-quality manufacturing, Infineon brings you a versatile product that is ideal for a wide range of applications. With its 32-bit architecture, advanced peripherals like DMA channels, and high clock frequency of 200 MHz, this microcontroller offers unmatched performance and flexibility. Experience seamless connectivity with CAN interfaces and precise ADC channels. Whether you're designing consumer electronics or automotive systems, the TC267D40F200NBCKXUMA1 delivers exceptional value and benefits to meet your unique requirements.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage 1.43 V

Allows for a wide range of input voltages, making the product versatile for different applications.

Bit Size 32

Offers high computational power and efficiency for processing tasks.

No. of Terminals 292

Enables multiple connections and interfaces, expanding the product's capabilities for connectivity.

ROM Words 2621440

Large memory capacity for storing program instructions and data, facilitating complex operations.

RAM Bytes 245760

Sufficient memory for temporary data storage and quick access, optimizing performance.

Maximum Clock Frequency 200 MHz

High clock speed allows for fast processing of instructions and data, enhancing overall speed and efficiency.

Connectivity CAN(5)

Includes CAN connectivity, enabling communication with other devices in automotive and industrial applications.

Technical Specifications

Microcontrollers TC267D40F200NBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

A/D INPUT LINES 50; 7 ADC MODULES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

0

No. of Terminals:

292

On Chip Program ROM Width:

8

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

RAM Bytes:

245760

ROM Words:

2621440

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(5)

Peripherals:

DMA(48)

Trade Compliance

TC267D40F200NBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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