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SPA06N60C3XKSA1

Infineon Technologies

SPA06N60C3XKSA1 by Infineon Technologies

SPA06N60C3XKSA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage. Ideal for SWITCHING applications, it features 18.6A IDM and 0.75 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 150°C and EAS of 200mJ.

Median Price

$1.120

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$0.303

100+ parts

$0.293

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7

$0.303

$0.293

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Chip1Stop

Japan . 7 parts In-Stock

1+ parts

$0.998

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7

$0.998

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Rochester

USA . 3,000 parts In-Stock

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$1.430

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$1.190

10k+ parts

$1.060

3,000

-

$1.430

$1.190

$1.060

Verical

USA . 500 parts In-Stock

1+ parts

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$1.243

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500

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$1.243

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Avnet

USA . 400 parts In-Stock

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400

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Digiode

USA . 281 parts In-Stock

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$0.569

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281

$0.569

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.034

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870

$1.034

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Vyrian

USA . 3,383 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 283 parts In-Stock

1+ parts

$0.510

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283

$0.510

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Corphita

USA . 896 parts In-Stock

1+ parts

$0.539

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896

$0.539

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Corohmni

South Africa . 68 parts In-Stock

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$0.853

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68

$0.853

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Aztec Data Supply Inc.

USA . 3,992 parts In-Stock

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$0.946

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$0.946

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Continental Prestige Electronics

USA . 3,575 parts In-Stock

1+ parts

$1.034

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$1.013

3,575

$1.034

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$1.013

Argo Parts USA

USA . 2,963 parts In-Stock

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$1.034

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2,963

$1.034

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.034

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$0.982

10k+ parts

$0.961

500

$1.034

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$0.982

$0.961

Modulus Dynamics

Lithuania . 8,394 parts In-Stock

1+ parts

$1.711

100+ parts

$1.643

1k+ parts

$1.574

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8,394

$1.711

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$1.574

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AZTECH Wire

Italy . 941 parts In-Stock

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$14.500

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$14.500

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Perfect Parts

USA . 582 parts In-Stock

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582

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iodParts Technologies Inc.

India . 350 parts In-Stock

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Overview

Unleash the power of innovation with the SPA06N60C3XKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are versatile and reliable for various applications. With a single configuration and built-in diode, this N-CHANNEL transistor is perfect for switching operations. Offering a maximum pulsed drain current of 18.6 A and a minimum DS breakdown voltage of 600 V, this transistor provides exceptional performance and efficiency. Say goodbye to limitations and hello to endless possibilities with the SPA06N60C3XKSA1 - your gateway to enhanced productivity and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides protection and insulation for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient channel for current flow in one direction, aiding in effective switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by integrating a diode, saving space and reducing component count.

Transistor Application: SWITCHING

Specifically designed for switching applications, delivering fast and efficient performance.

Minimum DS Breakdown Voltage: 600 V

Supports high voltage operation, making it suitable for a wide range of applications that require high voltage handling.

Package Shape: RECTANGULAR

Facilitates easy placement on PCBs and enables efficient heat dissipation for enhanced performance.

Terminal Form: THROUGH-HOLE

Allows for easy soldering onto the PCB, ensuring secure connections.

Operating Mode: ENHANCEMENT MODE

Operates efficiently in enhancement mode, offering precise control over the switching process.

Maximum Pulsed Drain Current (IDM): 18.6 A

Capable of handling high pulsed currents, making it suitable for applications requiring transient current handling.

Avalanche Energy Rating (EAS): 200 mJ

Provides protection against voltage spikes and transient events, enhancing the reliability of the transistor.

No. of Terminals: 3

Simple three-terminal design for ease of integration into circuits.

Package Style (Meter): FLANGE MOUNT

Enables secure mounting in systems, ensuring stability and reliability in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient power handling and low ON resistance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for demanding environments.

Transistor Element Material: SILICON

Uses high-quality silicon material for reliable and consistent performance over time.

Terminal Finish: TIN

Tin finish on terminals offers good solderability and corrosion resistance, ensuring long-term reliability.

Maximum Drain Current (ID): 6.2 A

Can handle continuous high drain currents, suitable for applications with continuous power requirements.

Maximum Drain-Source On Resistance: 0.75 ohm

Low ON resistance minimizes power loss and heat generation, improving efficiency in power conversion.

Terminal Position: SINGLE

Simplified single terminal position for easy connection in the circuit.

Case Connection: ISOLATED

Isolated case connection for enhanced safety and protection against electrical hazards.

Technical Specifications

Power Field Effect Transistors (FET) SPA06N60C3XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

6.2 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18.6 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA06N60C3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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