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SAF-TC1165-192F80HLAA

Infineon Technologies

SAF-TC1165-192F80HLAA by Infineon Technologies

Limited Part Number Data;

Median Price

$16.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$13.040

1k+ parts

$11.670

10k+ parts

$10.980

240

-

$13.040

$11.670

$10.980

DigiKey

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$17.160

1k+ parts

-

10k+ parts

-

240

-

$17.160

-

-

Verical

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$16.300

1k+ parts

$14.588

10k+ parts

$13.725

240

-

$16.300

$14.588

$13.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5 parts In-Stock

1+ parts

$13.804

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$13.804

-

-

-

Vyrian

USA . 3,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,602

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 608 parts In-Stock

1+ parts

$13.077

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$13.077

-

-

-

Component Stockers USA

USA . 316 parts In-Stock

1+ parts

$14.770

100+ parts

$13.890

1k+ parts

-

10k+ parts

-

316

$14.770

$13.890

-

-

Andel Nordic

Denmark . 2,434 parts In-Stock

1+ parts

$46.140

100+ parts

-

1k+ parts

$32.298

10k+ parts

$32.298

2,434

$46.140

-

$32.298

$32.298

Microchip USA

USA . 2,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,424

-

-

-

-

Technical Specifications

Additional Parts SAF-TC1165-192F80HLAA attributes and parameters. Explore more Additional Parts devices from Infineon Technologies

Technical Specifications

Core Processor:

TriCore™

Other Names:

SAF-TC1165-192F80HLAATR
SAF-TC1165-192F80HLAA-ND
SP000105860
SAF-TC1165-192F80HLAAINTR-ND
SAF-TC1165-192F80HLAAIN
SAF-TC1165-192F80HLAA
SAF-TC1165-192F80HLAATR-ND
SAF-TC1165-192F80HLAAINTR
SAFTC1165192F80HLAAX

Speed:

80MHz

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

FLASH

RAM Size:

100K x 8

Number of I/O:

81

Peripherals:

DMA, POR, WDT

Mounting Type:

Surface Mount

Oscillator Type:

External

Supplier Device Package:

PG-LQFP-176-2

Standard Package:

40

Series:

TC116x

Package / Case:

176-LQFP

Core Size:

32-Bit Single-Core

Connectivity:

CANbus, SPI, UART/USART

Program Memory Size:

1.5MB (1.5M x 8)

Package:

Tray

Data Converters:

A/D 36x12b

Voltage - Supply (Vcc/Vdd):

1.42V ~ 1.58V

Base Product Number:

SAF-TC1165

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

SAF-TC1165-192F80HLAA Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8542.31.0001

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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