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PEF22554E

Infineon Technologies

PEF22554E by Infineon Technologies

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$51.210

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 3 parts In-Stock

1+ parts

$51.210

100+ parts

$51.210

1k+ parts

$51.210

10k+ parts

$47.796

3

$51.210

$51.210

$51.210

$47.796

Digiode

USA . 1,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,315

-

-

-

-

Vyrian

USA . 951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

951

-

-

-

-

Martec Srl

Italy . 134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

134

-

-

-

-

Bristol Electronics

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 1,584 parts In-Stock

1+ parts

$8.546

100+ parts

-

1k+ parts

-

10k+ parts

-

1,584

$8.546

-

-

-

Texas Native Microelectronics

USA . 50 parts In-Stock

1+ parts

$9.823

100+ parts

$9.430

1k+ parts

$9.135

10k+ parts

$8.644

50

$9.823

$9.430

$9.135

$8.644

Kenton Components

USA . 4,517 parts In-Stock

1+ parts

$11.788

100+ parts

-

1k+ parts

-

10k+ parts

$10.373

4,517

$11.788

-

-

$10.373

Modulus Dynamics

Lithuania . 4,239 parts In-Stock

1+ parts

$14.578

100+ parts

$13.995

1k+ parts

$13.412

10k+ parts

-

4,239

$14.578

$13.995

$13.412

-

Qasali Group International

UK . 3,727 parts In-Stock

1+ parts

$26.522

100+ parts

-

1k+ parts

$24.666

10k+ parts

$23.339

3,727

$26.522

-

$24.666

$23.339

Corphita

USA . 908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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908

-

-

-

-

Perfect Parts

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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150

-

-

-

-

Technical Specifications

Digital Transmission Controllers PEF22554E attributes and parameters. Explore more Digital Transmission Controllers devices from Infineon Technologies

Specs

Carrier Type-1:

CEPT PCM-30/E-1

Carrier Type-2:

T-1(DS1)

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA160,14X14,40

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

PEF22554E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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