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MB90F387SPMCR-GS-N2E1

Infineon Technologies

MB90F387SPMCR-GS-N2E1 by Infineon Technologies

Infineon's MB90F387SPMCR-GS-N2E1 is a 16-bit microcontroller with 48 terminals, 2048 bytes of RAM, and 65536 ROM words. It operates at up to 16 MHz, supports CAN and UART connectivity, and features low power mode. Ideal for applications requiring high-speed processing and multiple I/O lines in a compact form factor.

Median Price

$26.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

$26.000

100+ parts

$20.540

1k+ parts

$17.940

10k+ parts

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250

$26.000

$20.540

$17.940

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Distributors (In-Stock)

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Vyrian

USA . 7,777 parts In-Stock

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7,777

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Digiode

USA . 595 parts In-Stock

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595

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$13.060

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231

$13.060

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Argo Parts USA

USA . 2,439 parts In-Stock

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2,439

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Continental Prestige Electronics

USA . 1,368 parts In-Stock

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1,368

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Corphita

USA . 222 parts In-Stock

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222

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Microchip USA

USA . 131 parts In-Stock

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131

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of cutting-edge technology with the MB90F387SPMCR-GS-N2E1 microcontroller by Infineon Technologies. Built to exceed expectations, this versatile device offers unparalleled performance and reliability in a compact package. From automotive to industrial applications, this microcontroller is designed to streamline processes and enhance efficiency. Experience seamless connectivity with CAN and UART interfaces, while low power mode ensures energy savings without compromising on speed. Elevate your projects with the MB90F387SPMCR-GS-N2E1 and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for flexibility in power sources and compatibility with a wide range of electronic systems.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data processing and handling, improving overall performance.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount on a PCB, optimizing board layout and design.

Bit Size: 16

A larger bit size allows for more complex calculations and data manipulation, enhancing the microcontroller's capabilities.

No. of Terminals: 48

Having a sufficient number of terminals enables better connectivity and integration with external components and peripherals.

Minimum Supply Voltage: 3.5 V

Lower minimum supply voltage allows for efficient power management and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability and stability in harsh operating conditions or industrial environments.

CPU Family: F2MC-16LX

Being part of the F2MC-16LX family indicates a proven and reliable microcontroller architecture with a track record of successful implementations.

No. of External Interrupts: 4

Multiple external interrupts allow the microcontroller to respond quickly to external events, enhancing real-time capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the microcontroller can function in cold environments or extreme temperature conditions.

ADC Channels: YES

Analog to Digital Converter channels enable the microcontroller to interface with analog sensors or signals, expanding its input capabilities.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals simplifies system design and reduces the need for additional external components.

No. of Timers: 6

Having multiple timers allows for precise timing control and scheduling of tasks, improving efficiency in time-critical applications.

RAM Bytes: 2048

A larger RAM size enables more data storage and processing capabilities, enhancing the microcontroller's performance in complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 8-Ch 10-Bit

Having multiple ADC channels with 10-bit resolution allows for accurate and precise analog signal conversion, suitable for a wide range of applications.

Connectivity: CAN, UART

Support for CAN and UART communication protocols enables the microcontroller to interface with various devices and systems, enhancing connectivity options.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in firmware updates and customization, allowing for easy adaptation to changing requirements.

Technical Specifications

Microcontrollers MB90F387SPMCR-GS-N2E1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

F2MC-16LX

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

4

No. of I/O Lines:

36

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

16 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN, UART

Peripherals:

POR, TIMER(6), WDT(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MB90F387SPMCR-GS-N2E1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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