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KP256XTMA1

Infineon Technologies

KP256XTMA1 by Infineon Technologies

Infineon KP256XTMA1 is a 10-bit capacitive pressure sensor with digital voltage output (0.4-2.9V). Operating from -40 to 125°C, it has a pressure range of 8.702-23.931 Psi and SPI interface for surface mount applications in various industries.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,769 parts In-Stock

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Digiode

USA . 145 parts In-Stock

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145

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Corohmni

South Africa . 239 parts In-Stock

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$1.695

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239

$1.695

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Aztec Data Supply Inc.

USA . 190 parts In-Stock

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$2.400

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190

$2.400

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Modulus Dynamics

Lithuania . 1,035 parts In-Stock

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$3.153

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$3.027

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$2.901

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1,035

$3.153

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Semicontronic

India . 253 parts In-Stock

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$10.750

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$10.481

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$10.428

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253

$10.750

$10.481

$10.428

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AZTECH Wire

Italy . 795 parts In-Stock

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$19.744

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Ampacity Inc.

Singapore . 367 parts In-Stock

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$26.750

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Continental Prestige Electronics

USA . 5,315 parts In-Stock

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Corphita

USA . 887 parts In-Stock

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Argo Parts USA

USA . 649 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Elevate your pressure sensing capabilities with the KP256XTMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality pressure sensors that offer unparalleled precision and reliability. Ideal for a wide range of applications, this capacitive pressure sensor provides valuable insights into pressure changes with its digital voltage output. With a compact square design and versatile mounting options, the KP256XTMA1 is the perfect solution for customers seeking high-performance pressure sensing technology. Trust in Infineon to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Maximum Supply Voltage: 3.475 V

Higher supply voltage allows the sensor to operate at peak performance, providing accurate readings.

Port Type: HOLE

The hole port type allows for easy installation and usage in a variety of applications.

No. of Bits: 10

A higher number of bits ensures better resolution and accuracy in pressure readings.

Body Width: 7 inch

The 7-inch body width provides a sturdy and durable construction for the sensor.

Sensors or Transducers Type: PRESSURE SENSOR,CAPACITIVE

Capacitive pressure sensors offer high stability and accuracy in measuring pressure changes.

Body Height: 2.8 mm

Low body height allows for easy integration into compact spaces or devices.

Package Shape or Style: SQUARE

Square package shape provides a stable and secure mounting option for the sensor.

Minimum Supply Voltage: 3.135 V

Lower minimum supply voltage ensures efficient power consumption and prolongs battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the sensor to be used in harsh environments without degradation.

Output Range: 0.4-2.9V

Wide output range provides flexibility in reading pressure levels accurately.

Output Type: DIGITAL VOLTAGE

Digital voltage output ensures compatibility with modern digital systems for easy data processing.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature makes the sensor suitable for use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish offers corrosion resistance and durable connections.

Maximum Operating Current: 10 mA

Low operating current enables energy-efficient operation of the sensor.

Maximum Pressure Range: 23.931 Psi

Wide pressure range allows the sensor to measure a broad spectrum of pressures accurately.

Housing: PLASTIC

Plastic housing provides a lightweight and cost-effective solution for the sensor's enclosure.

Minimum Pressure Range: 8.702 Psi

Minimum pressure range enables accurate measurement of lower pressure levels.

Pressure Sensing Mode: ABSOLUTE

Absolute pressure sensing mode is ideal for applications where reference to a perfect vacuum is required.

Body Length/Diameter: 7 mm

Compact body length/diameter allows for easy integration and installation in limited spaces.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for the sensor.

Output Interface Type: SPI INTERFACE

SPI interface enables fast and efficient communication with other digital devices.

Mounting Feature: SURFACE MOUNT

Surface mount feature allows for easy and convenient mounting on PCBs or other surfaces.

Technical Specifications

Pressure Sensors KP256XTMA1 attributes and parameters. Explore more Pressure Sensors devices from Infineon Technologies

Specs

Additional Features:

AEC-Q100; IT ALSO HAS SUPPLY VOLTAGE 4.75 TO 5.25 V; IT HAS SENSITIVITY OF 9.74 LSB/KPA

Body Width:

7 inch

Body Height:

2.8 mm

Body Length/Diameter:

7 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

10

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Port Type:

HOLE

Maximum Pressure Range:

23.931 Psi

Minimum Pressure Range:

8.702 Psi

Pressure Sensing Mode:

ABSOLUTE

Sensors or Transducers Type:

Maximum Supply Voltage:

3.475 V

Minimum Supply Voltage:

3.135 V

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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