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IRPS5401MXI04TRPAUMA1

Infineon Technologies

IRPS5401MXI04TRPAUMA1 by Infineon Technologies

Infineon Technologies' IRPS5401MXI04TRPAUMA1 is a surface mount Power Management IC with 1 function. It has a square package shape, 56 terminals, and operates at temperatures ranging from -40 to 85 °C. This IC is commonly used as a power supply support circuit in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,399 parts In-Stock

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Digiode

USA . 864 parts In-Stock

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Nova Conductors

Japan . 71 parts In-Stock

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Ampacity Inc.

Singapore . 727 parts In-Stock

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$1.500

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727

$1.500

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Semicontronic

India . 720 parts In-Stock

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$3.500

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$3.412

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$3.395

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720

$3.500

$3.412

$3.395

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Modulus Dynamics

Lithuania . 258 parts In-Stock

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$6.924

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$6.647

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$6.370

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258

$6.924

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$6.370

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AZTECH Wire

Italy . 202 parts In-Stock

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$16.315

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Aztec Data Supply Inc.

USA . 3,608 parts In-Stock

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$19.670

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Corohmni

South Africa . 63 parts In-Stock

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$22.819

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Continental Prestige Electronics

USA . 3,069 parts In-Stock

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Microchip USA

USA . 2,585 parts In-Stock

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Argo Parts USA

USA . 1,570 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Corphita

USA . 919 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the IRPS5401MXI04TRPAUMA1 by Infineon Technologies, a high-quality Power Management IC that offers unparalleled value and advantages. With its surface mount capability and compact size, this IC is perfect for various applications. Whether you need power supply support or multiple channels, this product has got you covered. Its adjustable threshold and wide operating temperature range make it suitable for industrial use. Trust in Infineon Technologies' expertise and choose the IRPS5401MXI04TRPAUMA1 for reliable and efficient power management solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs, saving space and facilitating efficient assembly.

Nominal Supply Voltage (Vsup): 5 V

Operates at a commonly used and stable voltage level, ensuring compatibility with various systems and components.

No. of Terminals: 56

Provides ample connection points for versatile applications and configurations.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments or applications that generate heat.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, ensuring reliability in harsh environments.

Width (mm): 7 mm

Compact width enables installation in space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically to support power supply functions, ensuring efficient and stable power distribution.

Maximum Supply Current (Isup): 45 mA

Can handle moderate current loads, suitable for powering multiple components without overloading.

No. of Channels: 5

Multiple channels allow for simultaneous management and distribution of power to different components or subsystems.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables precise connections and compact layout on the PCB.

Adjustable Threshold: YES

Ability to adjust threshold levels offers flexibility and customization for specific application requirements.

Technical Specifications

Power Management ICs IRPS5401MXI04TRPAUMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N56

Length:

7 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

45 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

IRPS5401MXI04TRPAUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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