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IR1167BSTRPBF

Infineon Technologies

IR1167BSTRPBF by Infineon Technologies

IR1167BSTRPBF by Infineon Technologies is a MOSFET Gate Driver with 18V max supply voltage, 15V power supplies, and 7A nominal output peak current limit. It is used in applications requiring fast turn-on/off times like motor control systems or power inverters.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 6 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

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6

$1.980

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-

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Arrow

USA . 6 parts In-Stock

1+ parts

$1.994

100+ parts

$1.635

1k+ parts

$1.539

10k+ parts

-

6

$1.994

$1.635

$1.539

-

Verical

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$1.635

1k+ parts

$1.539

10k+ parts

-

6

-

$1.635

$1.539

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 581 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

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581

$0.463

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.837

100+ parts

-

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100

$1.837

-

-

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Bristol Electronics

USA . 446 parts In-Stock

1+ parts

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1k+ parts

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446

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LWI Electronics Inc

India . 40 parts In-Stock

1+ parts

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40

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Vyrian

USA . 6 parts In-Stock

1+ parts

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6 parts In-Stock

1+ parts

$0.414

100+ parts

-

1k+ parts

-

10k+ parts

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6

$0.414

-

-

-

Semicontronic

India . 6 parts In-Stock

1+ parts

$0.414

100+ parts

$0.404

1k+ parts

$0.402

10k+ parts

-

6

$0.414

$0.404

$0.402

-

Corphita

USA . 903 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

-

10k+ parts

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903

$0.438

-

-

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Modulus Dynamics

Lithuania . 4,724 parts In-Stock

1+ parts

$1.402

100+ parts

$1.346

1k+ parts

$1.290

10k+ parts

-

4,724

$1.402

$1.346

$1.290

-

Corohmni

South Africa . 165 parts In-Stock

1+ parts

$1.402

100+ parts

-

1k+ parts

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165

$1.402

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Continental Prestige Electronics

USA . 2,568 parts In-Stock

1+ parts

$1.837

100+ parts

-

1k+ parts

-

10k+ parts

$1.800

2,568

$1.837

-

-

$1.800

Argo Parts USA

USA . 2,565 parts In-Stock

1+ parts

$1.837

100+ parts

-

1k+ parts

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10k+ parts

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2,565

$1.837

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-

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AZTECH Wire

Italy . 303 parts In-Stock

1+ parts

$8.010

100+ parts

-

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303

$8.010

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Aztec Data Supply Inc.

USA . 3,308 parts In-Stock

1+ parts

$13.325

100+ parts

-

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3,308

$13.325

-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,310 parts In-Stock

1+ parts

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29,310

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Perfect Parts

USA . 11,934 parts In-Stock

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11,934

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

-

-

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,500

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Microchip USA

USA . 4,704 parts In-Stock

1+ parts

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4,704

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A-Z Elektronik GmbH

Germany . 1,590 parts In-Stock

1+ parts

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100+ parts

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1,590

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Alle Elektronik GmbH

Germany . 1,060 parts In-Stock

1+ parts

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100+ parts

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1,060

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GreenTree Electronics

Israel . 446 parts In-Stock

1+ parts

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446

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Overview

Enhance the performance of your power electronics with the IR1167BSTRPBF MOSFET Gate Driver from Infineon Technologies. With Infineon's renowned quality and expertise in semiconductor solutions, this compact and efficient driver is perfect for a wide range of applications. Experience faster turn-on and turn-off times, precise control, and reliable operation with this versatile component. Trust Infineon to deliver cutting-edge technology and unmatched value with the IR1167BSTRPBF. Elevate your designs and maximize your results with this high-quality gate driver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside, ensuring long-term performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 18 V

Ability to handle high supply voltage ensures stable operation in varied electrical systems.

Package Shape: RECTANGULAR

Rectangular shape enhances compatibility with standard PCB layouts and facilitates efficient placement within electronic systems.

Power Supplies (V): 15

Optimal power supply voltage rating for maintaining reliable performance under typical operating conditions.

No. of Terminals: 8

Sufficient number of terminals for connecting to external circuitry, allowing for versatile applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style conserves space on the PCB, ideal for compact and densely populated electronic designs.

Minimum Supply Voltage: 12 V

Ability to operate at a low minimum supply voltage ensures compatibility with a wide range of power sources.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel finish provides reliable electrical connections and corrosion resistance for extended product lifespan.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit configuration and helps optimize signal paths for improved performance.

Maximum Seated Height: 1.75 mm

Low seated height contributes to a compact overall design and facilitates efficient heat dissipation for reliable operation.

Width: 3.9 mm

Narrow width enables easy integration into tight spaces on the PCB, ideal for applications with limited board area.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with standard soldering processes and industry practices.

Length: 4.9 mm

Moderate length allows for easy handling and installation on the PCB, facilitating smooth assembly processes.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical attachment and alignment during soldering, enhancing overall reliability.

Nominal Supply Voltage: 15 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Turn-on Time: 0.08 us

Fast turn-on time ensures quick response and efficient switching operations, contributing to overall system performance.

Terminal Pitch: 1.27 mm

Optimal terminal pitch facilitates easy PCB layout and secure mounting, ensuring reliable electrical connections.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates resistance to moisture-related damage, making the product suitable for various environmental conditions.

Nominal Output Peak Current Limit: 7 A

High nominal output peak current limit allows for robust performance in demanding applications, ensuring reliable operation under heavy loads.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Interface IC type offers versatility in driving MOSFETs, enabling effective control and efficient operation in diverse circuit configurations.

Turn-off Time: 0.065 us

Short turn-off time ensures rapid response and efficient switching characteristics, enhancing overall performance and reliability.

Technical Specifications

MOSFET Gate Drivers IR1167BSTRPBF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Nominal Output Peak Current Limit:

7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

12 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.065 us

Turn-on Time:

.08 us

Width:

3.9 mm

Trade Compliance

IR1167BSTRPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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