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IPA90R340C3

Infineon Technologies

IPA90R340C3 by Infineon Technologies

Infineon Technologies' IPA90R340C3 is a power FET with N-channel polarity. It has a min DS breakdown voltage of 900V and can handle a max pulsed drain current of 34A. This transistor is commonly used for switching applications.

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3

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1k+

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Vyrian

USA . 565 parts In-Stock

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 19,860 parts In-Stock

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$0.441

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$0.423

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$0.406

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Aztec Data Supply Inc.

USA . 701 parts In-Stock

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Ampacity Inc.

Singapore . 1,454 parts In-Stock

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Andel Nordic

Denmark . 272 parts In-Stock

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AZTECH Wire

Italy . 618 parts In-Stock

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Infinite Electronics LLP (Excess)

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A-Z Elektronik GmbH

Germany . 11,667 parts In-Stock

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Lixinc

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Alle Elektronik GmbH

Germany . 4,278 parts In-Stock

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Continental Prestige Electronics

USA . 2,448 parts In-Stock

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Perfect Parts

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Bastille Electronics

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Overview

Discover the power of the IPA90R340C3 by Infineon Technologies! As a leading manufacturer in the industry, Infineon brings you a high-quality Power Field Effect Transistor (FET) that delivers exceptional performance and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a minimum DS Breakdown Voltage of 900V, ensuring efficient operation in a variety of scenarios. With its single configuration and built-in diode, it simplifies your design process while maximizing functionality. The IPA90R340C3 is designed to handle a maximum pulsed drain current of 34A, making it perfect for demanding projects. Experience the value, benefits, and advantages this innovative product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers good mechanical strength and thermal resistance, making the transistor durable and reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better characteristics and efficiency compared to P-channel transistors, making this product a good choice for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the reliability and performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast and efficient switching capabilities, making it suitable for various power control tasks.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this transistor can handle high voltages securely, ensuring safe operation in high-power circuits.

Maximum Pulsed Drain Current (IDM): 34 A

The high pulsed drain current rating allows the transistor to handle momentary overloads without damage, providing robust performance in dynamic operating conditions.

Maximum Power Dissipation (Abs): 35 W

The high power dissipation rating ensures that the transistor can handle heat dissipation effectively, contributing to its reliability and longevity.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can function reliably in various environments without overheating, ensuring stable performance under challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPA90R340C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

678 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.34 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA90R340C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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